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  • Tuesday, Oct 7th
    1:00pm - 5:00pm MT
    IEEE - IRDS Packaging Integration – History & Roadmap for AI
    Location: West Building, 100 Level, Room 105 BC
    Heterogeneous IntegrationAdvanced Packaging
  • Tuesday, Oct 7th
    1:00pm - 1:05pm MT
    Welcome and Introduction
    Location: West Building, 100 Level, Room 105 BC
    Session Moderator (AP): Mark da Silva, PhD – SEMI
    Heterogeneous IntegrationAdvanced Packaging
  • Tuesday, Oct 7th
    1:05pm - 1:20pm MT
    Session Overview
    Location: West Building, 100 Level, Room 105 BC
    Speaker (AP): Dev Gupta – APSTL
    Heterogeneous IntegrationAdvanced Packaging
  • Tuesday, Oct 7th
    1:20pm - 2:10pm MT
    History of Advanced Packaging & Applications to AI
    Location: West Building, 100 Level, Room 105 BC
    Speaker (AP): Dev Gupta – APSTL
    Heterogeneous IntegrationAdvanced Packaging
  • Tuesday, Oct 7th
    2:10pm - 2:40pm MT
    IEEE-IRDS: The Comprehensive Semiconductor Roadmap That Has Driven the Industry for Three Decades
    Location: West Building, 100 Level, Room 105 BC
    Heterogeneous IntegrationAdvanced Packaging
  • Tuesday, Oct 7th
    2:40pm - 3:00pm MT
    Break
    Location: West Building, 100 Level, Room 105 BC
    Heterogeneous IntegrationAdvanced Packaging
  • Tuesday, Oct 7th
    3:00pm - 3:25pm MT
    New PI Architectures for AI
    Location: West Building, 100 Level, Room 105 BC
    Speaker (AP): Paul Franzon – North Carolina State University
    Heterogeneous IntegrationAdvanced Packaging
  • Tuesday, Oct 7th
    3:25pm - 3:50pm MT
    Advanced Packaging Technology Gaps for Future PI for AI & H
    Location: West Building, 100 Level, Room 105 BC
    Speaker (AP): Dev Gupta – APSTL
    Heterogeneous IntegrationAdvanced Packaging
  • Tuesday, Oct 7th
    3:50pm - 4:15pm MT
    New Dense Interconnects for AI
    Location: West Building, 100 Level, Room 105 BC
    Speaker (AP): Laura W. Mirkarimi – Adeia
    Heterogeneous IntegrationAdvanced Packaging
  • Tuesday, Oct 7th
    4:15pm - 4:40pm MT
    Advanced Lithography for Dense Package Interconnects on Large Panels
    Location: West Building, 100 Level, Room 105 BC
    Speaker (AP): Koichiro Saito – Ushio America, Inc.
    Speaker (AP): Yu Takada – Ushio
    Heterogeneous IntegrationAdvanced Packaging
  • Tuesday, Oct 7th
    4:40pm - 5:00pm MT
    Q&A and Wrap up
    Location: West Building, 100 Level, Room 105 BC
    Session Moderator (AP): Dev Gupta – APSTL
    Heterogeneous IntegrationAdvanced Packaging
  • Tuesday, Oct 7th
    5:00pm - 6:00pm MT
    IRDS Session Happy Hour
    Location: West Building, 100 Level, Room 105 BC
    Heterogeneous IntegrationAdvanced Packaging