Advanced Packaging Session

 Heterogeneous Integration & Advanced Packaging Session
Implementing Heterogeneous Integration and Advanced Packaging in the Era of Artificial Intelligence

As AI workloads grow exponentially, the demand for power-efficient, high-bandwidth interconnect architectures has become critical. These architectures are the backbone of next-generation computing, enabling faster data movement between processors, memory, and accelerators while minimizing energy consumption.

Designing these systems involves a multidisciplinary approach—leveraging advanced materials (e.g., low-loss dielectrics, optical interposers), innovative architectures (chiplets, 2.5D/3D integration), and precision manufacturing processes. Challenges include power delivery, thermal management, signal integrity, and yield optimization, all requiring cutting-edge equipment and process control.

Looking ahead, the industry must focus on standardizing and proliferating cost-effective building blocks. This includes developing interoperable interconnect standards, scalable packaging platforms, and modular design methodologies to accelerate adoption and reduce costs across diverse AI applications.

This session is co-hosted by the SEMI Advanced Packaging Heterogeneous Integration (APHI) Technology Community and the Electronic Packaging Society (EPS) of IEEE