Full Schedule

8:00am - 10:00am MT

Graphical User Interfaces (GUI) Task Force Meeting

Location: North Building, 200 Level, Room 231A

Standards

8:00am - 10:00am MT

S8 (Ergonomics) Revision Task Force Meeting - Part 1

Location: North Building, 200 Level, Room 232B

Standards

3:00pm - 4:00pm MT

Electron Microscopy (EM) Workflow Task Force Meeting

Location: North Building, 200 Level, Room 232A

Standards

3:00pm - 4:00pm MT

Fire Protection Task Force Meeting

Location: North Building, 200 Level, Room 232B

Standards

4:00pm - 4:30pm MT

Energetic Materials EHS Task Force Meeting

Location: North Building, 200 Level, Room 232B

Standards

4:00pm - 5:30pm MT

Fab & Equipment Computer & Device Security (CDS) Task Force Meeting

Location: North Building, 200 Level, Room 231A

Standards

6:00pm - 7:30pm MT

SEMI Standards Awards Ceremony & Networking Event

Location: North Building, 200 Level, Room 229B

Standards

8:30am - 10:40am MT

CEO Summit Keynotes

Location: West Building, 300 Level, Ballroom 301A

CEO Summit Keynotes

8:30am - 8:40am MT

Welcome Remarks

Location: West Building, 300 Level, Ballroom 301A

Speaker: – SEMI

CEO Summit Keynotes

8:40am - 8:50am MT

Opening Remarks

Location: West Building, 300 Level, Ballroom 301A

Speaker: – SEMI

CEO Summit Keynotes

8:50am - 9:10am MT

Keynote: State of Arizona

Location: West Building, 300 Level, Ballroom 301A

Keynote Speaker (CEO Summit): – State of Arizona

CEO Summit Keynotes

9:10am - 9:35am MT

Keynote: Lam Research

Location: West Building, 300 Level, Ballroom 301A

Keynote Speaker (CEO Summit): – Lam Research

CEO Summit Keynotes

9:35am - 9:50am MT

Presentation of the SEMI Award for North America

Location: West Building, 300 Level, Ballroom 301A

Keynote Moderator: – SEMI

CEO Summit Keynotes

9:50am - 10:15am MT

Keynote: DuPont

Location: West Building, 300 Level, Ballroom 301A

Keynote Speaker (CEO Summit): – DuPont

CEO Summit Keynotes

10:15am - 10:25am MT

A New Approach to the Future of Talent: Introducing the National Network for Microelectronics Education

Location: West Building, 300 Level, Ballroom 301A

Keynote Speaker (CEO Summit): – SEMI and SEMI Foundation

CEO Summit Keynotes

10:25am - 10:45am MT

Keynote: Presentation Title TBD

Location: West Building, 300 Level, Ballroom 301A

Keynote Speaker (CEO Summit): – The Trade & Investment Promoter of Costa Rica (PROCOMER)

CEO Summit Keynotes

10:45am - 11:10am MT

Advancing 3DIC Technologies to Propel AI Innovations

Location: West Building, 300 Level, Ballroom 301A

Keynote Speaker (CEO Summit): – Taiwan Semiconductor Manufacturing Corporation (TSMC)

CEO Summit Keynotes

11:10am - 11:15am MT

Closing Remarks

Location: West Building, 300 Level, Ballroom 301A

Speaker: – SEMI

CEO Summit Keynotes

2:20pm - 2:30pm MT

Keynote - Google

Location: West Building, 300 Level, Ballroom 301A

Keynote Speaker (CEO Summit): – Google

CEO Summit Keynotes

9:00am - 12:00pm MT

Facilities & Gases North America Technical Committee Chapter Meeting

Location: North Building, 200 Level, Room 231B

Standards

9:00am - 12:00pm MT

Silicon Wafer North America Technical Committee Chapter Meeting

Location: North Building, 200 Level, Room 232A

Standards

9:00am - 6:00pm MT

Semiconductor Climate Consortium (SCC) Members Only (Tue)

SCC Members Only

9:00am - 11:00am MT

SCC: Scope 2 WG - Energy Efficiency

SCC Members Only

11:00am - 1:00pm MT

SCC: ERP WG - Data and Reporting Deep Dive

SCC Members Only

4:00pm - 6:00pm MT

SCC Scope 3 WG -Decarbonizing Upstream Materials

SCC Members Only

5:00pm - 6:00pm MT

EC Steering Committee Meeting

SCC Members Only

10:00am - 11:00am MT

Energy Saving Equipment Communication (ESEC) Task Force Meeting

Location: North Building, 200 Level, Room 231A

Standards

10:00am - 11:00am MT

S6 Revision Task Force Meeting

Location: North Building, 200 Level, Room 232B

Standards

10:15am - 10:30am MT

Sustainability Sessions Welcome and Overview

Location: Sustainability Pavilion Theater, North Building, Expo Floor

Speaker (Sus): – SEMI

EHS & Sustainability

10:30am - 12:15pm MT

Resources for Expanding Operations in the US (REO), Day 1 AM

Location: West Building/100 Level/104AB

Session Moderator (REO): – Arizona Commerce Authority

Supply Chain | REO

10:35am - 10:50am MT

Arizona Commerce Authority - Presentation Title TBD

Location: West Building/100 Level/104AB

Speaker (REO): – Arizona Commerce Authority

Supply Chain | REO

10:50am - 11:10am MT

Driving Certainty and Speed in Semiconductor Fab Construction

Location: West Building/100 Level/104AB

Speaker (REO): – Bechtel Corporation

Supply Chain | REO

11:10am - 11:30am MT

DSV - Presentation Title TBD

Location: West Building/100 Level/104AB

Speaker (REO): – DSV

Supply Chain | REO

11:30am - 11:50am MT

Mortenson - Presentation Title TBD

Location: West Building/100 Level/104AB

Speaker (REO): – Mortenson

Supply Chain | REO

11:50am - 12:15pm MT

Intel - Presentation Title TBD

Location: West Building/100 Level/104AB

Speaker (REO): – Intel

Supply Chain | REO

10:30am - 12:30pm MT

Advancing Flexible Hybrid Electronics for Next-Gen Devices and Systems

Location: North Building, 300 Level, Hall B

FHE

10:30am - 10:35am MT

Welcome Remarks and Session Overview

Location: North Building, 300 Level, Hall B

Session Moderator (FHE): – SEMI

FHE

10:35am - 10:55am MT

Enhancing Flexible Hybrid Electronics Through Diazirine-Based Surface Bonding Technologies

Location: North Building, 300 Level, Hall B

Speaker (FHE): – XLYNX Materials Inc.

FHE

10:55am - 11:15am MT

E-Tattoos and E-Skins Bridging Humans and Robots

Location: North Building, 300 Level, Hall B

Speaker (FHE): – The University of Texas at Austin

FHE

11:15am - 11:35am MT

Flexible Bioelectronics for Wireless Skin-Conformal Neuromuscular and Performance Monitoring

Location: North Building, 300 Level, Hall B

Speaker (FHE): – Lehigh University

FHE

11:35am - 11:55am MT

Low-Temperature SnBiAg Solder Solution for Flexible Substrates

Location: North Building, 300 Level, Hall B

Speaker (FHE): – Heraeus Materials Singapore Pte Ltd

FHE

12:20pm - 12:30pm MT

Closing Remarks

Location: North Building, 300 Level, Hall B

Session Moderator (FHE): – SEMI

FHE

11:55pm - 12:20pm MT

Manufacturing elastic multilayer printed circuits for flexible hybrid electronics

Location: North Building, 300 Level, Hall B

Speaker (FHE): – VTT

FHE

10:30am - 12:30pm MT

TechTALKS: Chips Without Borders: Building a Resilient Materials Supply Chain

Location: TechTALKS, West Building, 100 Level, Room 101A

TechTALKS

10:35am - 11:00am MT

Entegris - Presentation Title TBD

Location: TechTALKS, West Building, 100 Level, Room 101A

Speaker (Materials): – Entegris

TechTALKS

11:00am - 11:20am MT

Materion - Presentation Title TBD

Location: TechTALKS, West Building, 100 Level, Room 101A

Speaker (Materials): – Materion

TechTALKS

11:20am - 11:40am MT

Applied Materials - Presentation Title TBD

Location: TechTALKS, West Building, 100 Level, Room 101A

Speaker (Materials): – Applied Materials

TechTALKS

11:40am - 12:00pm MT

Techcet - Presentation Title TBD

Location: TechTALKS, West Building, 100 Level, Room 101A

Speaker (Materials): – TECHCET

TechTALKS

12:00pm - 12:25pm MT

Panel Discussion

Location: TechTALKS, West Building, 100 Level, Room 101A

Panelist (Materials): – Applied Materials

Panelist (Materials): – Materion

Panelist (Materials): – Entegris

Panelist (Materials): – TECHCET

TechTALKS

10:30am - 12:40pm MT

Workforce Development: Developing a Sustainable Talent Pipelines through Partnerships

Location: Workforce Development Pavilion Theater, Lower Level, Expo Floor

Workforce Development

10:30am - 10:55am MT

Vision to Reality: Launching a Statewide Semiconductor Apprenticeship Strategy in One Year

Location: Workforce Development Pavilion Theater, Lower Level, Expo Floor

Speaker (WFD): – Arizona Commerce Authority

Workforce Development

11:00am - 11:25am MT

Talent Solutions on the Fresh Coast: A New Model for Semiconductor Workforce Development

Location: Workforce Development Pavilion Theater, Lower Level, Expo Floor

Speaker (WFD): – Michigan Economic Development Corp

Speaker (WFD): – Michigan Economic Development Corporation

Workforce Development

11:30am - 12:10pm MT

The National Network for Microelectronics Education & SMART USA

Location: Workforce Development Pavilion Theater, Lower Level, Expo Floor

Fireside Chat Speaker (WFD): – SEMI Foundation

Fireside Chat Speaker (WFD): – SMARTUSA

Workforce Development

12:15pm - 12:40pm MT

Building a Collaborative Regional Consortium for Semiconductor Workforce Development

Location: Workforce Development Pavilion Theater, Lower Level, Expo Floor

Speaker (WFD): – NY Creates

Workforce Development

10:30am - 12:50pm MT

EHS Regulatory Threats, Supply Chain Challenges, Research Opportunities and Industry Collaboration

Location: Sustainability Pavilion Theater, North Building, Expo Floor

EHS & Sustainability

10:30am - 10:40am MT

Welcome Remarks and Session Overview

Location: Sustainability Pavilion Theater, North Building, Expo Floor

EHS & Sustainability

10:40am - 11:00am MT

US EPA AIM Act Technology Transition Rule and TSCA PFAS Reporting Rule: Opportunities for the Semiconductor Industry

Location: Sustainability Pavilion Theater, North Building, Expo Floor

Speaker (EHS): – Beveridge & Diamond

EHS & Sustainability

11:00am - 11:20am MT

US Department of Defense Perspective on Semiconductor Supply Chain Risks

Location: Sustainability Pavilion Theater, North Building, Expo Floor

Speaker (EHS): – United States Department of Defense

EHS & Sustainability

11:20am - 11:40am MT

Update on SEMI PFAS Transparency Working Group

Location: Sustainability Pavilion Theater, North Building, Expo Floor

Speaker (EHS): – Tokyo Electron US

Speaker (EHS): – Intel Corp.

EHS & Sustainability

11:40am - 12:00pm MT

SEMI EHS Priorities

Location: Sustainability Pavilion Theater, North Building, Expo Floor

Speaker (EHS): – SEMI

EHS & Sustainability

12:00pm - 12:45pm MT

SEMI EHS Supply Chain Panel

Location: Sustainability Pavilion Theater, North Building, Expo Floor

Panel Moderator (Sus): – SEMI

Panelist (EHS): – Beveridge & Diamond

Panelist (EHS): – TRC

Panelist (EHS): – Intel

Panelist (EHS): – JSR Micro

Panelist (Sus): – SCREEN SPE USA

EHS & Sustainability

12:45pm - 12:50pm MT

Closing Remarks

Location: Sustainability Pavilion Theater, North Building, Expo Floor

Session Moderator (EHS): – SEMI

EHS & Sustainability

10:30am - 1:00pm MT

Smart Manufacturing 1: Digital Twins for Design & Manufacturing #1

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Smart Manufacturing

10:30am - 10:35am MT

Welcome Remarks and Session Overview

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Session Moderator (SMfg): – Tokyo Electron America

Smart Manufacturing

10:35am - 10:55am MT

Integrating Digital Twins, Machine Learning, and Expert Systems to Optimize Fab Facility Operations.

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker (SMfG): – Intel Corporation

Smart Manufacturing

10:55am - 11:15am MT

Using Virtual Silicon & Machine Learning to Improve Yield in Advanced Semiconductor Manufacturing

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker (SMfG): – Lam Research

Smart Manufacturing

11:15am - 11:35am MT

Reliable Digital Twins with Robust AI for Predictive Quality in Semiconductor Materials Manufacturing

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker (SMfG): – EMD Electronics

Smart Manufacturing

11:35am - 11:55am MT

A digital twin ecosystem to propel domestic semiconductor manufacturing

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker (SMfG): – Carnegie Mellon University

Speaker (SMfG): – University of Texas at Austin

Smart Manufacturing

11:55am - 12:15pm MT

Benefits Captured from a Digital Twin Platform with Integrated Machine Learning Capabilities

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker (SMfG): – Cohu (Tignis)

Smart Manufacturing

12:15pm - 12:35pm MT

Dual-Channel Digital Twins: Harnessing EDA and SECS/GEM for Real-Time Equipment Optimization

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker (SMfG): – Agileo Automation

Smart Manufacturing

12:35pm - 12:55pm MT

A Unified Data Lake Platform for Accelerating AI Engineering

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker (SMfG): – Amazon (AWS)

Smart Manufacturing

12:55pm - 1:00pm MT

Closing Remarks

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Session Moderator (SMfg): – Tokyo Electron America

Smart Manufacturing

10:30am - 4:40pm MT

Future of Computing: Energy-Efficient Computing for AI and Beyond

Location: West Building,100 Level,106BC

Smart Data / AI

10:30am - 10:35am MT

Welcome Remarks and Session Overview

Location: West Building,100 Level,106BC

Session Moderator (FoC): – SEMI

Smart Data / AI

10:35am - 11:00am MT

Rapidus - Presentation Title TBD

Location: West Building,100 Level,106BC

Speaker (Foc): – Rapidus

Smart Data / AI

11:00am - 11:25am MT

Keynote: Stanford University: Performance Limitations of Si CMOS and Alternatives for Nanoelectronics

Location: West Building,100 Level,106BC

Speaker (Foc): – Stanford University

Smart Data / AI

11:25am - 11:50am MT

Challenging the Status Quo: From Chip Innovation to Compute Optimization

Location: West Building,100 Level,106BC

Speaker (Foc): – Siemens AG

Smart Data / AI

11:50am - 12:15pm MT

AMD - Presentation Title TBD

Location: West Building,100 Level,106BC

Speaker (Foc): – AMD

Smart Data / AI

12:15pm - 12:40pm MT

Microsoft - Presentation Title TBD

Location: West Building,100 Level,106BC

Speaker (Foc): – Microsoft

Smart Data / AI

12:40pm - 12:45pm MT

Session 1 Wrap-up

Location: West Building,100 Level,106BC

Session Moderator (FoC): – SEMI

Smart Data / AI

2:00pm - 2:05pm MT

Welcome Remarks and Session Overview

Location: West Building,100 Level,106BC

Session Moderator (FoC): – SEMI

Smart Data / AI

2:05pm - 2:30pm MT

Next generation semiconductor to support AI resiliency

Location: West Building,100 Level,106BC

Speaker (Foc): – IBM

Smart Data / AI

2:30pm - 2:55pm MT

Merck KGaA, Darmstadt, Germany – The Glue Layer of Semiconductors: Powering Energy-Efficient Chips Through Advanced Materials

Location: West Building,100 Level,106BC

Speaker (Foc): – Merck KGaA, Darmstadt, Germany

Smart Data / AI

2:55pm - 3:20pm MT

HPE Labs - Computing Futures from AI to Quantum to GenZ

Location: West Building,100 Level,106BC

Speaker (Foc): – Hewlett Packard Enterprise

Smart Data / AI

3:20pm - 3:45pm MT

Ciena - Presentation Title TBD

Location: West Building,100 Level,106BC

Speaker (Foc): – Ciena

Smart Data / AI

3:45pm - 4:10pm MT

Rigetti - Presentation Title TBD

Location: West Building,100 Level,106BC

Speaker (Foc): – Rigetti

Smart Data / AI

4:10pm - 4:35pm MT

Quantum Economic Development Corporation (QEDC) - Presentation Title TBD

Location: West Building,100 Level,106BC

Speaker (Foc): – Quantum Economic Development Consortium

Smart Data / AI

4:35pm - 4:40pm MT

Closing Remarks

Location: West Building,100 Level,106BC

Session Moderator (FoC): – SEMI

Smart Data / AI

11:00am - 12:00pm MT

S7 Revision Task Force Meeting

Location: North Building, 200 Level, Room 232B

Standards

11:00am - 12:00pm MT

Sensor Bus Task Force Meeting

Location: North Building, 200 Level, Room 231A

Standards

1:00pm - 2:00pm MT

Lunch Panel: Ecosystem-Connected Digital Twins: Transforming Semiconductor Fabs with Nvidia Omniverse

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Panel Moderator (SMfg): – Nvidia Omniverse

Smart Manufacturing

1:00pm - 3:00pm MT

S1 (Labels) Revision Task Force Meeting

Location: North Building, 200 Level, Room 232B

Standards

1:00pm - 4:00pm MT

Diagnostic Data Acquisition (DDA) Task Force Meeting

Location: North Building, 200 Level, Room 231A

Standards

1:00pm - 4:00pm MT

Emerging Technologies and Innovation Partnerships

Location: West Building, 100 Level, 106A

Startup

Co-Presented by:

1:00pm - 1:05pm MT

Welcome Remarks - Plug and Play Tech Center

Location: West Building, 100 Level, 106A

Session Moderator (Emerging Tech): – Plug and Play

Speaker (Emerging Tech): – Arizona Commerce Authority.

Startup

1:05pm - 1:10pm MT

Welcome Remarks - SEMI

Location: West Building, 100 Level, 106A

Speaker (Emerging Tech): – SEMI

Session Moderator (Emerging Tech): – Plug and Play

Startup

1:10pm - 1:20pm MT

Welcome Remarks - City of Phoenix

Location: West Building, 100 Level, 106A

Distinguished Speaker: – City of Phoenix, Arizona

Startup

1:20pm - 1:40pm MT

Keynote: Arizona State University

Location: West Building, 100 Level, 106A

Speaker (Emerging Tech): – Arizona State University

Startup

1:40pm - 2:10pm MT

Executive Fireside Chat: Shaping the Next-Generation of AI

Location: West Building, 100 Level, 106A

Fireside Chat Moderator: – Arizona Commerce Authority.

Fireside Chat Speaker (Emerging Tech): – Applied Materials

Fireside Chat Speaker (Emerging Tech): – Groq

Fireside Chat Speaker (Emerging Tech): – Plug and Play

Fireside Chat Speaker (Emerging Tech): – onsemi

Startup

2:10pm - 2:25pm MT

Intel Corporation Innovation Pitch

Location: West Building, 100 Level, 106A

Speaker (Emerging Tech): – Intel

Startup

2:25pm - 2:45pm MT

Pilot Partnership Panel 1

Location: West Building, 100 Level, 106A

Panel Moderator (Emerging Tech): – Plug and Play

Panelist (Emerging Tech): – Arkestro

Panelist (Emerging Tech): – EMD Electronics

Startup

2:25pm - 3:45pm MT

Startups & Corporate Showcases: Successful Corporate/Startup Pilots

Location: West Building, 100 Level, 106A

Startup

2:45pm - 3:05pm MT

Pilot Partnership Panel 2

Location: West Building, 100 Level, 106A

Panel Moderator (Emerging Tech): – PLUG and PLAY

Panelist (Emerging Tech): – Mitsubishi Electric

Panelist (Emerging Tech): – Facilis

Startup

3:05pm - 3:25pm MT

Pilot Partnership Panel 3

Location: West Building, 100 Level, 106A

Panel Moderator (Emerging Tech): – Plug and Play

Panelist (Emerging Tech): – Celus

Startup

3:25pm - 3:45pm MT

Pilot Partnership Panel 4

Location: West Building, 100 Level, 106A

Panel Moderator (Emerging Tech): – Intel Capital

Panelist (Emerging Tech): – Intel

Panelist (Emerging Tech): – EUV Tech

Startup

3:50pm - 4:00pm MT

Closing Remarks

Location: West Building, 100 Level, 106A

Session Moderator (Emerging Tech): – Plug and Play

Speaker (Emerging Tech): – Arizona Commerce Authority.

Startup

1:00pm - 4:00pm MT

Liquid Chemicals North America Technical Committee Chapter Meeting - Day 1

Location: North Building, 200 Level, Room 231B

Standards

1:00pm - 1:20pm MT

Welcome Remarks

Location: West Building, 100 Level, 106A

Startup

1:00pm - 4:00pm MT

The Convergence of Semiconductor Manufacturing and Design

Location: West Building, 100 Level, Room 101C

Design

1:00pm - 1:05pm MT

Welcome Remarks

Location: West Building, 100 Level, Room 101C

Session Moderator (Design): – SEMI

Design

1:05pm - 1:10pm MT

Session Overview

Location: West Building, 100 Level, Room 101C

Session Moderator (Design): – PDF Solutions

Design

1:10pm - 1:30pm MT

Revolutionizing Silicon to Systems Design: Unlocking the Future with 2.5D and 3D Multi-Die Innovations

Location: West Building, 100 Level, Room 101C

Speaker (Design): – Synopsys

Design

1:30pm - 1:50pm MT

Manufacturing to Development to Manufacturing for Circular Collaboration Leveraging AI and Other EDA Advances

Location: West Building, 100 Level, Room 101C

Speaker (Design): – Breker

Design

1:50pm - 2:10pm MT

Bridging the Silicon Divide: Converging Chip Design and Manufacturing in the Era of High Integration

Location: West Building, 100 Level, Room 101C

Speaker (Design): – Qualcomm Technologies

Design

2:10pm - 2:30pm MT

3D and Chiplets Driving Moore’s Law into the Future

Location: West Building, 100 Level, Room 101C

Speaker (Design): – Siemen EDA

Design

2:30pm - 2:50pm MT

Multiphysics & Multiscale Challenges and Solutions for 3D Heterogenous Integration

Location: West Building, 100 Level, Room 101C

Speaker (Design): – Ansys, part of Synopsys

Design

2:50pm - 3:00pm MT

Break

Location: West Building, 100 Level, Room 101C

Design

3:00pm - 3:50pm MT

Panel Discussion: The Convergence of Semiconductor Manufacturing and Design

Location: West Building, 100 Level, Room 101C

Panel Moderator (Design): – PDF Solutions

Panelist (Design): – Breker

Panelist (Design): – Qualcomm Technologies

Panelist (Design): – Siemen EDA

Panelist (Design): – Synopsys

Design

3:50pm - 4:00pm MT

Audience Q & A

Location: West Building, 100 Level, Room 101C

Panel Moderator: – PDF Solutions

Design

4:00pm - 4:05pm MT

Closing Remarks

Location: West Building, 100 Level, Room 101C

Session Moderator: – SEMI

Design

4:00pm - 4:30pm MT

Networking

Location: West Building, 100 Level, 106A

Startup

1:00pm - 5:00pm MT

IEEE - IRDS Packaging Integration – History & Roadmap for AI

Location: West Building, 100 Level, Room 105BC

Heterogeneous Integration

1:00pm - 1:05pm MT

Welcome and Introduction

Location: West Building, 100 Level, Room 105BC

Session Moderator (AP): – SEMI

Heterogeneous Integration

1:05pm - 1:20pm MT

Session Overview

Location: West Building, 100 Level, Room 105BC

Speaker (AP): – APSTL

Heterogeneous Integration

1:20pm - 2:10pm MT

History of Advanced Packaging & Applications to AI

Location: West Building, 100 Level, Room 105BC

Speaker (AP): – APSTL

Heterogeneous Integration

2:10pm - 2:40pm MT

IEEE-IRDS: The Comprehensive Semiconductor Roadmap That Has Driven the Industry for Three Decades

Location: West Building, 100 Level, Room 105BC

Heterogeneous Integration

2:40pm - 3:00pm MT

Break

Location: West Building, 100 Level, Room 105BC

Heterogeneous Integration

3:00pm - 3:25pm MT

New PI Architectures for AI

Location: West Building, 100 Level, Room 105BC

Speaker (AP): – North Carolina State University

Heterogeneous Integration

3:25pm - 3:50pm MT

Advanced Packaging Technology Gaps for Future PI for AI & H

Location: West Building, 100 Level, Room 105BC

Speaker (AP): – APSTL

Heterogeneous Integration

3:50pm - 4:15pm MT

New Dense Interconnects for AI

Location: West Building, 100 Level, Room 105BC

Speaker (AP): – Adeia

Heterogeneous Integration

4:15pm - 4:40pm MT

Advanced Lithography for Dense Package Interconnects on Large Panels

Location: West Building, 100 Level, Room 105BC

Speaker (AP): – Ushio

Heterogeneous Integration

4:40pm - 5:00pm MT

Q&A and Wrap up

Location: West Building, 100 Level, Room 105BC

Session Moderator (AP): – APSTL

Heterogeneous Integration

1:30pm - 2:20pm MT

Strategic Silicon: Geopolitics Shaping the Future of Semiconductors

Location: West Building, 300 Level, Ballroom 301A

Panel Moderator (CEO Summit): – Bloomberg News

Panelist (CEO Summit): – ASML

Panelist (CEO Summit Fireside Chat): – Intel

Panelist (CEO Summit): – Lam Research

Panelist (CEO Summit): – Arm

Executive Panel

1:30pm - 5:00pm MT

Workforce Development: Raising Industry Awareness and Building a Future Workforce

Location: Workforce Development Pavilion Theater, Lower Level, Expo Floor

Workforce Development

1:30pm - 1:55pm MT

Building the Future Workforce: Sparking K-12 Excitement with Microelectronics Education

Location: Workforce Development Pavilion Theater, Lower Level, Expo Floor

Speaker (WFD): – Arizona State University

Speaker (WFD): – Arizona State University Preparatory Academy

Speaker (WFD): – Arizona State University

Workforce Development

2:00pm - 2:25pm MT

Chips for the Future: Building K-12 Pathways to Semiconductor Careers

Location: Workforce Development Pavilion Theater, Lower Level, Expo Floor

Speaker (WFD): – Microelectronics Education and Research Center - Boise State University

Speaker (WFD): – Boise State University - Microelectronics Education and Research Center

Speaker (WFD): – Micron

Workforce Development

2:30pm - 2:55pm MT

Building a Scalable, Collaborative Semiconductor Workforce Ecosystem: Lessons from Texas

Location: Workforce Development Pavilion Theater, Lower Level, Expo Floor

Speaker (WFD): – Texas Institute for Electronics

Speaker (WFD): – Austin Community College

Speaker (WFD): – North Texas Semiconductor Institute/University of Texas at Dallas

Workforce Development

3:00pm - 3:30pm MT

Advancing Workforce Development Through Materials Science Education: Empowering K–12 Educators

Location: Workforce Development Pavilion Theater, Lower Level, Expo Floor

Speaker (WFD): – ASM Materials Education Foundation

Workforce Development

3:30pm - 3:55pm MT

Project Circuit Breaker: Breaking Barriers and Entering the Field of Semiconductors

Location: Workforce Development Pavilion Theater, Lower Level, Expo Floor

Speaker (WFD): – Nikon Precision Inc.

Workforce Development

4:00pm - 4:55pm MT

Embracing Diversity: The Role of Allies in the Semiconductor Industry

Location: Workforce Development Pavilion Theater, Lower Level, Expo Floor

Panel Moderator (WFD): – SEMI Foundation

Panelist (WFD): – WGNSTAR

Workforce Development

1:30pm - 5:30pm MT

Global Standards Summit

Location: North Building, 200 Level, Room 229A

Standards

1:30pm - 1:40pm MT

Welcome and Reminders

Location: North Building, 200 Level, Room 229A

Session Moderator (GSS): – SEMI

Standards

1:40pm - 1:55pm MT

Introduction and Level Setting

Location: North Building, 200 Level, Room 229A

Session Moderator (GSS): – Tokyo Electron

Standards

1:55pm - 2:05pm MT

Session 1: Supply Chain Traceability

Location: North Building, 200 Level, Room 229A

Standards

2:05pm - 2:20pm MT

Semiconductors Chip Customer Perspective

Location: North Building, 200 Level, Room 229A

Speaker (GSS): – Qualcomm

Standards

2:20pm - 2:35pm MT

Provenance (how to trace all the way up the supply chain)

Location: North Building, 200 Level, Room 229A

Speaker (GSS): – The Provenance Chain Network

Standards

2:35pm - 2:50pm MT

Product Security (to ensure no counterfiets/ tampering)

Location: North Building, 200 Level, Room 229A

Speaker (GSS): – AMD

Standards

2:50pm - 3:05pm MT

Preventing Supply Chain Disruptions

Location: North Building, 200 Level, Room 229A

Speaker (GSS): – SEMI

Standards

3:25pm - 3:35pm MT

Session 2: Environmental Sustainability

Location: North Building, 200 Level, Room 229A

Standards

3:35pm - 3:50pm MT

PFAS Transparency

Location: North Building, 200 Level, Room 229A

Speaker (GSS): – Tokyo Electron US

Speaker (GSS): – Intel Corp.

Standards

3:50pm - 4:05pm MT

Energy Efficient Manufacturing

Location: North Building, 200 Level, Room 229A

Speaker (GSS): – FTD Solutions

Standards

4:05pm - 4:20pm MT

Environmental Sustainability Considerations in Building Future Facilities

Location: North Building, 200 Level, Room 229A

Speaker (GSS): – Jacobs

Standards

4:30pm - 5:15pm MT

Global Standards Panel Discussion

Location: North Building, 200 Level, Room 229A

Panelist (GSS): – AMD

Panelist (GSS): – FTD Solutions

Panelist (GSS): – Intel Corp.

Panelist (GSS): – The Provenance Chain Network

Panelist (GSS): – Jacobs

Panelist (GSS): – Qualcomm

Panelist (GSS): – SEMI

Panelist (GSS): – Tokyo Electron US

Panelist (GSS): – Intel

Standards

5:15pm - 5:30pm MT

Wrap Up and Next Steps

Location: North Building, 200 Level, Room 229A

Session Moderator (GSS): – Tokyo Electron

Standards

5:30pm - 5:35pm MT

Closing Remarks and Adjourn

Location: North Building, 200 Level, Room 229A

Session Moderator (GSS): – SEMI

Standards

1:35pm - 5:00pm MT

Resources for Expanding Operations in the US (REO), Day 1 PM

Location: West Building/100 Level/104AB

Supply Chain | REO

1:40pm - 2:00pm MT

Project Delivery Accelerator – Kill the “Go-Slow-Machine”

Location: West Building/100 Level/104AB

Speaker (REO): – WMA Architects

Supply Chain | REO

2:00pm - 2:20pm MT

Aging Freighter Fleets and the U.S. Semiconductor Rollout: Is Air Cargo Capacity a Hidden Risk?

Location: West Building/100 Level/104AB

Speaker (REO): – Kuehne+Nagel

Supply Chain | REO

2:20pm - 2:40pm MT

SSOE - Presentation Title TBD

Location: West Building/100 Level/104AB

Speaker (REO): – SSOE Group

Supply Chain | REO

2:40pm - 3:10pm MT

Mckinsey / Clark Pacific - Presentation Title TBD

Location: West Building/100 Level/104AB

Speaker (REO): – McKinsey & Company

Speaker (REO): – Clark Pacific

Supply Chain | REO

3:45pm - 4:00pm MT

Greater Phoenix Economic Council - Presentation Title TBD

Location: West Building/100 Level/104AB

Speaker (REO): – Greater Phoenix Economic Council

Supply Chain | REO

4:00pm - 4:20pm MT

Reshoring Initiative - Presentation Title TBD

Location: West Building/100 Level/104AB

Speaker (REO): – Reshoring Initiative

Supply Chain | REO

4:20pm - 4:40pm MT

Digital Twins at Scale: The Role of 3D Modeling in Fab Construction

Location: West Building/100 Level/104AB

Speaker (REO): – ZELUS

Supply Chain | REO

4:40pm - 5:00pm MT

Clark Street Associates - The Inside Playbook For Semiconductor Companies on How to Secure Government Funding under the New Trump Regime

Location: West Building/100 Level/104AB

Speaker (REO): – Clark Street Associates

Supply Chain | REO

2:00pm - 4:05pm MT

Smart MedTech: Driving Healthcare Innovation with Semiconductors

Smart MedTech

2:00pm - 2:05pm MT

Welcome Remarks

Session Moderator (SMedT): – SEMI

Smart MedTech

2:05pm - 2:15pm MT

The Medical Device Manufacturing Multiplier Consortium - MDM2

Speaker (SMedT): – MDM2

Smart MedTech

2:15pm - 2:40pm MT

MedTech Innovation and Value Creation

Speaker (SMedT): – McKinsey & Company

Smart MedTech

2:40pm - 2:55pm MT

Small Robots for Big Cures

Speaker (SMedT): – Mayo Clinic College of Medicine and Science

Smart MedTech

2:55pm - 3:10pm MT

Technologies for Wirelessly Connected Medical & Healthcare Point-of-Care Devices

Speaker (SMedT): – GlobalFoundries

Smart MedTech

3:10pm - 3:30pm MT

The Next 100 Years of EEG-based Devices

Speaker (SMedT): – Mayo Clinic

Smart MedTech

3:30pm - 3:45pm MT

Innovating Beyond Implantables: Opportunities for the Future of Wearable Technologies

Speaker (SMedT):

Smart MedTech

3:45pm - 4:00pm MT

Presentation Title TBD - Intel Corporation

Speaker (SMedT): – Intel Corporation

Smart MedTech

4:00pm - 4:05pm MT

Closing Remarks

Session Moderator (SMedT): – SEMI

Smart MedTech

2:00pm - 4:45pm MT

TechTALKS: Driving the Future of Semiconductors with Next-Level Silicon Design

Location: TechTALKS, West Building, 100 Level, Room 101A

TechTALKS

2:00pm - 2:05pm MT

Welcome Remarks and Session Overview

Location: TechTALKS, West Building, 100 Level, Room 101A

Session Moderator (AdvS): – MEMC/GlobalWafers

TechTALKS

2:05pm - 2:30pm MT

Keynote: Microsoft

Location: TechTALKS, West Building, 100 Level, Room 101A

Speaker (AdvS): – Microsoft

TechTALKS

2:30pm - 2:50pm MT

Intel - Presentation Title TBD

Location: TechTALKS, West Building, 100 Level, Room 101A

Speaker (AdvS): – Intel

TechTALKS

2:50pm - 3:10pm MT

Nvidia - Presentation Title TBD

Location: TechTALKS, West Building, 100 Level, Room 101A

Speaker (AdvS): – NVIDIA

TechTALKS

3:10pm - 3:30pm MT

CEA-Leti - Presentation Title TBD

Location: TechTALKS, West Building, 100 Level, Room 101A

Speaker (AdvS): – CEA-Leti

TechTALKS

3:30pm - 3:50pm MT

Okmetic - Powering the Future: Optimized Silicon Substrates for GaN Power & RF devices

Location: TechTALKS, West Building, 100 Level, Room 101A

Speaker (AdvS): – Okmetic

TechTALKS

3:50pm - 4:10pm MT

Alif Semiconductor - Presentation Title TBD

Location: TechTALKS, West Building, 100 Level, Room 101A

Speaker (AdvS): – Alif Semiconductor

TechTALKS

4:10pm - 4:40pm MT

Panel Discussion

Location: TechTALKS, West Building, 100 Level, Room 101A

Panel Moderator (AdvS): – Soitec

TechTALKS

4:40pm - 4:45pm MT

Closing Remarks

Location: TechTALKS, West Building, 100 Level, Room 101A

Session Moderator (AdvS): – MEMC/GlobalWafers

TechTALKS

2:00pm - 4:50pm MT

Smart Manufacturing 2: Agentic AI in Manufacturing Operations #1

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Smart Manufacturing

2:00pm - 2:05pm MT

Welcome Remarks and Session Overview

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Session Moderator (SMfg): – PEER Group

Smart Manufacturing

2:05pm - 2:25pm MT

Improving electrical equipment maintenance decisions to optimize the uptime of manufacturing plants

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker (SMfG): – ABB

Smart Manufacturing

2:25pm - 2:45pm MT

Machine Learning Method for Yield Management and Prediction in Compound Semiconductor Manufacturing

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker (SMfG): – PDF Solutions

Smart Manufacturing

2:45pm - 3:05pm MT

Comprehensive autonomous R2R using Agentic AI to address today’s rising CMP processing challenges

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker (SMfG): – Future Foundation North America Inc

Smart Manufacturing

3:05pm - 3:25pm MT

Leveraging AI in Jabil’s Manufacturing Journey

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker (SMfG): – AWS

Speaker (SMfG): – Jabil Inc.

Smart Manufacturing

3:25pm - 3:45pm MT

Orchestrating Intelligence: Predictive AI Maintenance for the Modern Semiconductor Facility

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker (SMfG): – Intel Corp.

Speaker (SMfG): – Intel Corporation

Smart Manufacturing

3:45pm - 4:05pm MT

Virtual Metrology Done Right

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker (SMfG): – Gauss Labs

Smart Manufacturing

4:05pm - 4:25pm MT

Accelerating Semiconductor Process Development with AI: Deep Dive into Real-World Case Studies

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker (SMfG): – Cosmos Innovation

Smart Manufacturing

4:25pm - 4:45pm MT

The Evolution of AI Applications for Process Control

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Speaker: – PDF Solutions, Inc

Smart Manufacturing

4:45pm - 4:50pm MT

Closing Remarks

Location: Smart Manufacturing Pavilion Theater, Lower Level, Expo Floor

Session Moderator (SMfg): – PEER Group

Smart Manufacturing

2:30pm - 3:50pm MT

Voluntary Carbon Markets & Carbon Pricing

Location: Sustainability Pavilion Theater, North Building, Expo Floor

EHS & Sustainability

2:30pm - 2:50pm MT

Advance Market Commitments: Why Now for the Chips Industry

Location: Sustainability Pavilion Theater, North Building, Expo Floor

Speaker (Sus): – Charm Industrial

EHS & Sustainability

3:10pm - 3:50pm MT

Building Carbon Credits from High-Impact GHG ReductionLeveraging the VCM to monetize actions that reduce high-potency gases—such as F-gases and other powerful GHGs—through credit generation and project design

Location: Sustainability Pavilion Theater, North Building, Expo Floor

Speaker (Sus): – Suomi

EHS & Sustainability

2:35pm - 3:35pm MT

Sustainability Panel: Path to Success—The Semiconductor Industry Leads the Way

Location: West Building, 300 Level, Ballroom 301A

Panelist (Sus): – Applied Materials

Panelist (Sus): – BASF

Panelist (Sus): – Micron

Panelist (Sus): – Qualcomm, Inc

Panelist (Sus): – Google

Executive PanelEHS & Sustainability

3:00pm - 5:00pm MT

U.S. National Strategic Plan for Advanced Manufacturing – Town Hall for Semiconductor Manufacturing Inputs

Location: West Building, 100 Level, Room 103A

Speaker: – National Institute of Standards and Technology (NIST)

Advanced Manufacturing

3:00pm - 3:20pm MT

Welcome and Overview of the U.S. National Strategic Plan for Advanced Manufacturing

Location: West Building, 100 Level, Room 103A

Speaker: – National Institute of Standards and Technology (NIST)

Advanced Manufacturing

3:20pm - 4:45pm MT

Request for Information (RFI) Interactive Discussion

Location: West Building, 100 Level, Room 103A

Speaker: – National Institute of Standards and Technology (NIST)

Advanced Manufacturing

3:45pm - 4:00pm MT

Closing Remarks

Location: West Building, 100 Level, Room 103A

Speaker: – National Institute of Standards and Technology (NIST)

Advanced Manufacturing

4:00pm - 4:25pm MT

Climate and Social Impact

Location: Sustainability Pavilion Theater, North Building, Expo Floor

EHS & Sustainability

4:00pm - 4:10pm MT

Climate Equity & Social Impact Workgroup Session: Real-World Impact at the Intersection of Climate, Education & Partnership

Location: Sustainability Pavilion Theater, North Building, Expo Floor

Panel Moderator (Sus): – Lam Research

Panelist (Sus): – Tokyo Electron America

Panelist (Sus): – Chester City, PA

EHS & Sustainability

4:00pm - 5:00pm MT

Welcome to Phoenix Reception

Location: Expo Floor

Networking

4:30pm - 5:00pm MT

S3 (Heating Systems) Revision Task Force Meeting

Location: North Building, 200 Level, Room 232B

Standards

5:00pm - 6:30pm MT

Sustainability Reception

EHS & SustainabilityNetworking

8:00pm - 11:30pm MT

SEMICON West'ern

Location: 3rd Street

Networking