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Thu, Oct 9
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Tuesday, October 7, 2025
8:00am - 10:00am
MT
Graphical User Interfaces (GUI) Task Force Meeting
Standards
8:00am - 10:00am
MT
Graphical User Interfaces (GUI) Task Force Meeting
Location: North Building, 200 Level, 231A
Standards
8:00am - 10:00am
MT
S8 (Ergonomics) Revision Task Force Meeting - Part 1
Standards
8:00am - 10:00am
MT
S8 (Ergonomics) Revision Task Force Meeting - Part 1
Location: North Building, 200 Level, 232B
Standards
8:30am - 11:25am
MT
CEO Summit Keynotes
CEO Summit Keynotes
8:30am - 11:25am
MT
CEO Summit Keynotes
Location: West Building, 300 Level, Ballroom 301 A
CEO Summit Keynotes
8:30am - 8:40am
MT
Welcome Remarks
Location: West Building, 300 Level, Ballroom 301 A
Speaker:
Joe Stockunas
– SEMI
CEO Summit Keynotes
8:40am - 8:50am
MT
Opening Remarks
Location: West Building, 300 Level, Ballroom 301 A
Speaker:
Ajit Manocha
– SEMI
CEO Summit Keynotes
8:50am - 9:10am
MT
Keynote: State of Arizona
Location: West Building, 300 Level, Ballroom 301 A
Keynote Speaker (CEO Summit):
Katie Hobbs
– State of Arizona
CEO Summit Keynotes
9:10am - 9:35am
MT
AI in Every Layer: Future-Ready Strategy for Technology and Talent
Location: West Building, 300 Level, Ballroom 301 A
Keynote Speaker (CEO Summit):
Sesha Varadarajan
– Lam Research
CEO Summit Keynotes
9:35am - 9:50am
MT
Presentation of the SEMI Award for North America
Location: West Building, 300 Level, Ballroom 301 A
Keynote Moderator:
Joe Stockunas
– SEMI
CEO Summit Keynotes
9:50am - 10:15am
MT
Stronger Together – Building a Resilient Future for Semiconductors
Location: West Building, 300 Level, Ballroom 301 A
Keynote Speaker (CEO Summit):
Jon D. Kemp
– Qnity, DuPont Electronics
CEO Summit Keynotes
10:15am - 10:25am
MT
Where Vision Meets Execution: Global Executive Summit (GES) Unites Industry Leaders
Location: West Building, 300 Level, Ballroom 301A
Speaker:
Ajit Manocha
– SEMI
CEO Summit Keynotes
EHS & Sustainability
10:25am - 10:35am
MT
A New Approach to the Future of Talent: Introducing the National Network for Microelectronics Education
Location: West Building, 300 Level, Ballroom 301 A
Keynote Speaker (CEO Summit):
Shari Liss
– SEMI and SEMI Foundation
Special Guest:
Erwin Gianchandani
– National Science Foundation
CEO Summit Keynotes
10:35am - 10:55am
MT
Closer to Home: Costa Rica as a partner for succesful operations in the Western Hemisphere
Location: West Building, 300 Level, Ballroom 301 A
Keynote Speaker (CEO Summit):
Manuel Tovar Rivera
– Ministry of Foreign Trade of Costa Rica
CEO Summit Keynotes
10:55am - 11:20am
MT
Advancing 3DIC Technologies to Propel AI Innovations
Location: West Building, 300 Level, Ballroom 301 A
Keynote Speaker (CEO Summit):
Jun He
– Taiwan Semiconductor Manufacturing Corporation (TSMC)
CEO Summit Keynotes
11:20am - 11:25am
MT
Closing Remarks
Location: West Building, 300 Level, Ballroom 301 A
Speaker:
Joe Stockunas
– SEMI
CEO Summit Keynotes
9:00am - 12:00pm
MT
Facilities & Gases North America Technical Committee Chapter Meeting
Standards
9:00am - 12:00pm
MT
Facilities & Gases North America Technical Committee Chapter Meeting
Location: North Building, 200 Level, 231B
Standards
9:00am - 12:00pm
MT
Silicon Wafer North America Technical Committee Chapter Meeting
Standards
9:00am - 12:00pm
MT
Silicon Wafer North America Technical Committee Chapter Meeting
Location: North Building, 200 Level, 232A
Standards
9:00am - 6:00pm
MT
EC Steering Committee Meeting
EHS & Sustainability
5:00pm - 6:00pm
MT
EC Steering Committee Meeting
Location: North Building, Level 200, Room 227 B
EHS & Sustainability
9:00am - 6:00pm
MT
Semiconductor Climate Consortium (SCC) Members Only (Tue)
SCC Members Only
EHS & Sustainability
9:00am - 6:00pm
MT
Semiconductor Climate Consortium (SCC) Members Only (Tue)
Location: North Building, Level 200, Room 225 AB
SCC Members Only
EHS & Sustainability
9:00am - 11:00am
MT
SCC: Scope 2 WG - Energy Efficiency
Location: North Building, Level 200, Room 225 AB
SCC Members Only
EHS & Sustainability
11:00am - 1:00pm
MT
SCC: ERP WG - Data and Reporting Deep Dive
Location: North Building, Level 200, Room 225 AB
SCC Members Only
EHS & Sustainability
4:00pm - 6:00pm
MT
SCC Scope 3 WG -Decarbonizing Upstream Materials
Location: North Building, Level 200, Room 225 AB
SCC Members Only
EHS & Sustainability
10:00am - 11:00am
MT
Energy Saving Equipment Communication (ESEC) Task Force Meeting
Standards
10:00am - 11:00am
MT
Energy Saving Equipment Communication (ESEC) Task Force Meeting
Location: North Building, 200 Level, 231A
Standards
10:00am - 11:00am
MT
Film Frame FOUP (FFF) Task Force Meeting
Standards
10:00am - 11:00am
MT
Film Frame FOUP (FFF) Task Force Meeting
Location: North Building, 200 Level, 229B
Standards
10:00am - 11:00am
MT
S6 Revision Task Force Meeting
Standards
10:00am - 11:00am
MT
S6 Revision Task Force Meeting
Location: North Building, 200 Level, 232B
Standards
10:15am - 10:30am
MT
Sustainability Sessions Welcome and Overview
Speaker (Sus):
Saifi Usmani
– SEMI
EHS & Sustainability
10:15am - 10:30am
MT
Sustainability Sessions Welcome and Overview
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Speaker (Sus):
Saifi Usmani
– SEMI
EHS & Sustainability
Sponsors
Edwards, Greater Sacramento Economic Council, Schneider Electric, SCREEN Semiconductor Solutions Co., LTD, Tokyo Electron U.S. Holdings, Inc., Membrion Inc., Sundt
10:15am - 12:40pm
MT
Workforce Development: Developing a Sustainable Talent Pipelines through Partnerships
Workforce Development
10:15am - 12:40pm
MT
Workforce Development: Developing a Sustainable Talent Pipelines through Partnerships
Location: Workforce Development Pavilion Theater, North Hall, Lower Level, Expo Floor
Workforce Development
Sponsors
10:15am - 10:55am
MT
Arizona: Supplying the Next Generation of Talent
Location: Workforce Development Pavilion Theater, North Hall, Lower Level, Expo Floor
Panel Moderator (WFD):
Kolu Wilson
– Arizona Commerce Authority
Panelist (WFD):
Danny Fisher
– Maricopa Community Colleges
Panelist (WFD):
Nick Irigoyen
– SEMI Foundation
Panelist (WFD):
Scott A. Holman
– Amkor Technology
Workforce Development
11:00am - 11:25am
MT
Talent Solutions on the Fresh Coast: A New Model for Semiconductor Workforce Development
Location: Workforce Development Pavilion Theater, North Hall, Lower Level, Expo Floor
Speaker (WFD):
Rick VanIttersum
– SEMI Foundation
Workforce Development
11:30am - 12:10pm
MT
The National Network for Microelectronics Education & SMART USA
Location: Workforce Development Pavilion Theater, North Hall, Lower Level, Expo Floor
Fireside Chat Speaker (WFD):
Mike Glavin
– SEMI Foundation
Fireside Chat Speaker (WFD):
Ty Middleton
– SMARTUSA
Workforce Development
12:15pm - 12:40pm
MT
Building a Collaborative Regional Consortium for Semiconductor Workforce Development
Location: Workforce Development Pavilion Theater, North Hall, Lower Level, Expo Floor
Speaker (WFD):
Robert Geer
– NY Creates
Co-Presenter:
Christine McLear
– GlobalFoundries
Workforce Development
10:15am - 1:00pm
MT
Smart Manufacturing 1: Digital Twins for Design & Manufacturing #1
Smart Manufacturing
10:15am - 1:00pm
MT
Smart Manufacturing 1: Digital Twins for Design & Manufacturing #1
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Smart Manufacturing
Sponsors
10:15am - 10:20am
MT
Opening welcome & introduction to John Behenke
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Session Moderator (SMfg):
Anshu Bahadur
– SEMI
Smart Manufacturing
10:20am - 10:30am
MT
The ‘new’ Smart Manufacturing Pyramid & Roadmap!
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
John R. Behnke
– Inficon
Smart Manufacturing
10:30am - 10:35am
MT
Welcome Remarks and Session Overview
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Session Moderator (SMfg):
Thurston Taylor
– Tokyo Electron America
Smart Manufacturing
10:35am - 10:55am
MT
Integrating Digital Twins, Machine Learning, and Expert Systems to Optimize Fab Facility Operations.
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
Manoj Athawale
– Intel Corporation
Smart Manufacturing
10:55am - 11:15am
MT
Using Virtual Silicon & Machine Learning to Improve Yield in Advanced Semiconductor Manufacturing
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
Joseph Ervin
– Lam Research
Smart Manufacturing
11:15am - 11:35am
MT
Reliable Digital Twins with Robust AI for Predictive Quality in Semiconductor Materials Manufacturing
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
Gianni Klesse
– EMD Electronics
Smart Manufacturing
11:35am - 11:55am
MT
A digital twin ecosystem to propel domestic semiconductor manufacturing
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
Gary K. Fedder
– Carnegie Mellon University
Speaker (SMfG):
Dragan Djurdjanovic
– University of Texas at Austin
Smart Manufacturing
11:55am - 12:15pm
MT
Benefits Captured from a Digital Twin Platform with Integrated Machine Learning Capabilities
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
Boyd Finlay
– Cohu (Tignis)
Smart Manufacturing
12:15pm - 12:35pm
MT
Dual-Channel Digital Twins: Harnessing EDA and SECS/GEM for Real-Time Equipment Optimization
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
Fahad Golra
– Agileo Automation
Speaker (SMfG):
Marc Engel
– Agileo Automation
Smart Manufacturing
12:35pm - 12:55pm
MT
A Unified Data Lake Platform for Accelerating AI Engineering
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
Ananth Kommuri
– Amazon (AWS)
Speaker (SMfG):
Sebastian Salomon
– Amazon - AWS
Smart Manufacturing
12:55pm - 1:00pm
MT
Closing Remarks
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Session Moderator (SMfg):
Thurston Taylor
– Tokyo Electron America
Smart Manufacturing
10:30am - 12:15pm
MT
Resources for Expanding Operations in the US (REO), Day 1 AM
Session Moderator (REO):
Eric Rude
– SEMI
Supply Chain | REO
10:30am - 12:15pm
MT
Resources for Expanding Operations in the US (REO), Day 1 AM
Location: West Building, 100 Level, 104 AB
Session Moderator (REO):
Eric Rude
– SEMI
Supply Chain | REO
10:30am - 10:35am
MT
Opening Remarks
Location: West Building, 100 Level, 104 AB
Session Moderator (REO):
Eric Rude
– SEMI
Supply Chain | REO
10:35am - 10:50am
MT
Arizona: America's Semiconductor HQ
Location: West Building, 100 Level, 104 AB
Speaker (REO):
Fernando Garcia
– Arizona Commerce Authority
Supply Chain | REO
10:50am - 11:10am
MT
Driving Certainty and Speed in Semiconductor Fab Construction
Location: West Building, 100 Level, 104 AB
Speaker (REO):
Chad Cobbley
– Bechtel Corporation
Supply Chain | REO
11:10am - 11:30am
MT
The Emergence of 5PL: Enabling Revenue Growth & Structural Affordability via High Velocity Supply Chain Adaptability
Location: West Building, 100 Level, 104 AB
Speaker (REO):
Stuart Love
– DSV
Supply Chain | REO
11:30am - 11:50am
MT
Breaking Ground: Strategic Approaches to Maximize Investments
Location: West Building, 100 Level, 104 AB
Speaker (REO):
Chase Farnsworth
– Mortenson
Supply Chain | REO
11:50am - 12:15pm
MT
Innovative Construction Solutions for Leading Megaprojects
Location: West Building, 100 Level, 104 AB
Speaker (REO):
Matthew Ward
– Intel
Supply Chain | REO
10:30am - 12:30pm
MT
Advancing Flexible Hybrid Electronics for Next-Gen Devices and Systems
FHE
10:30am - 12:30pm
MT
Advancing Flexible Hybrid Electronics for Next-Gen Devices and Systems
Location: North Building, 300 Level, Hall B
FHE
10:30am - 10:35am
MT
Welcome Remarks and Session Overview
Location: North Building, 300 Level, Hall B
Session Moderator (FHE):
Gity Samadi
– SEMI
FHE
10:35am - 10:55am
MT
Enhancing Flexible Hybrid Electronics Through Diazirine-Based Surface Bonding Technologies
Location: North Building, 300 Level, Hall B
Speaker (FHE):
Stefania F. Musolino
– XLYNX Materials Inc.
FHE
10:55am - 11:15am
MT
E-Tattoos and E-Skins Bridging Humans and Robots
Location: North Building, 300 Level, Hall B
Speaker (FHE):
Nanshu Lu
– The University of Texas at Austin
FHE
11:15am - 11:35am
MT
Flexible Bioelectronics for Wireless Skin-Conformal Neuromuscular and Performance Monitoring
Location: North Building, 300 Level, Hall B
Speaker (FHE):
Dhruv R. Seshadri
– Lehigh University
FHE
11:35am - 11:55am
MT
Low-Temperature SnBiAg Solder Solution for Flexible Substrates
Location: North Building, 300 Level, Hall B
Speaker (FHE):
senthil kumar balasubramanian
– Heraeus Electronics
FHE
11:55am - 12:20pm
MT
Manufacturing Elastic Multilayer Printed Circuits for Flexible Hybrid Electronics
Location: North Building, 300 Level, Hall B
Speaker (FHE):
Tuomas Happonen
– VTT
FHE
12:20pm - 12:30pm
MT
Closing Remarks
Location: North Building, 300 Level, Hall B
Session Moderator (FHE):
Gity Samadi
– SEMI
FHE
10:30am - 12:30pm
MT
TechTALKS: Chips Without Borders: Building a Resilient Materials Supply Chain
TechTALKS
10:30am - 12:30pm
MT
TechTALKS: Chips Without Borders: Building a Resilient Materials Supply Chain
Location: TechTALKS, North Building, 300 Level, Expo Hall B
TechTALKS
10:30am - 10:35am
MT
Welcome and Session Overview
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Session Moderator (Materials):
Paul Besser
– Entegris
TechTALKS
10:35am - 11:00am
MT
Building a Resilient Materials Supply Chain in 2025
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Speaker (Materials):
Ajoy Zutshi
– Entegris
TechTALKS
11:00am - 11:20am
MT
Where Challenge Meets Opportunity: Navigating the Modern Semiconductor Supply Chain
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Speaker (Materials):
Uli Blankenstein
– Materion Corporation
TechTALKS
11:20am - 11:40am
MT
Accelerating Materials Development to Enable Next Generation Device Manufacturing
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Speaker (Materials):
Michael McSwiney
– Applied Materials
TechTALKS
11:40am - 12:00pm
MT
Materials Markets and the Impact of Changing Supply Chains
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Speaker (Materials):
Lita Shon-Roy
– TECHCET
TechTALKS
12:00pm - 12:25pm
MT
Panel Discussion
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Panel Moderator (Materials):
Kevin J. McLaughlin
– TECHCET
Panelist (Materials):
Michael McSwiney
– Applied Materials
Panelist (Materials):
Uli Blankenstein
– Materion Corporation
Panelist (Materials):
Ajoy Zutshi
– Entegris
Panelist (Materials):
Lita Shon-Roy
– TECHCET
TechTALKS
12:25pm - 12:30pm
MT
Closing Remarks
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Session Moderator (Materials):
Kevin J. McLaughlin
– TECHCET
TechTALKS
10:30am - 12:50pm
MT
EHS Regulatory Threats, Supply Chain Challenges, Research Opportunities and Industry Collaboration
EHS & Sustainability
10:30am - 12:50pm
MT
EHS Regulatory Threats, Supply Chain Challenges, Research Opportunities and Industry Collaboration
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
EHS & Sustainability
10:30am - 10:40am
MT
Welcome Remarks and Session Overview
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Speaker (EHS):
Jasleen Raisinghani
– Intel
EHS & Sustainability
10:40am - 11:00am
MT
US EPA AIM Act Technology Transition Rule and TSCA PFAS Reporting Rule: Opportunities for the Semiconductor Industry
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Speaker (EHS):
Russ LaMotte
– Beveridge & Diamond
EHS & Sustainability
11:00am - 11:20am
MT
US Department of Defense Perspective on Semiconductor Supply Chain Risks
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Speaker (EHS):
Michael Golden
– United States Department of Defense
EHS & Sustainability
11:20am - 11:40am
MT
Update on SEMI PFAS Transparency Working Group
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Speaker (EHS):
Andrew Petraszak
– Tokyo Electron US
Speaker (EHS):
Patrick Gottsacker
– Intel Corp.
EHS & Sustainability
11:40am - 12:00pm
MT
SEMI EHS Priorities
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Speaker (EHS):
James Amano
– SEMI
EHS & Sustainability
12:00pm - 12:45pm
MT
SEMI EHS Supply Chain Panel
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Panel Moderator (Sus):
James Amano
– SEMI
Panelist (EHS):
Russ LaMotte
– Beveridge & Diamond
Panelist (EHS):
Tricia Underwood
– TRC Companies
Panelist (EHS):
Susan L. Duncan
– Intel
Panelist (EHS):
Mark Slezak
– JSR Micro
Panelist (Sus):
Jim Snow
– SCREEN SPE USA
EHS & Sustainability
12:45pm - 12:50pm
MT
Closing Remarks
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Session Moderator (EHS):
James Amano
– SEMI
EHS & Sustainability
10:30am - 4:40pm
MT
Future of Computing: Energy-Efficient Computing for AI and Beyond
Smart Data / AI
10:30am - 4:40pm
MT
Future of Computing: Energy-Efficient Computing for AI and Beyond
Location: West Building,100 Level, Room 106 BC
Smart Data / AI
10:30am - 10:35am
MT
Welcome Remarks and Session Overview
Location: West Building,100 Level, Room 106 BC
Session Moderator (FoC):
Pushkar Apte
– SEMI
Smart Data / AI
10:35am - 11:00am
MT
The Next-Generation Advanced Foundry: Accelerating 2nm & Advanced Packaging Innovation Through Global Collaboration
Location: West Building,100 Level, Room 106 BC
Speaker (Foc):
Rozalia Beica
– Rapidus Design Solutions
Smart Data / AI
11:00am - 11:30am
MT
Keynote: Stanford University: Performance Limitations of Si CMOS and Alternatives for Nanoelectronics
Location: West Building,100 Level, Room 106 BC
Speaker (Foc):
Krishna Saraswat
– Stanford University
Smart Data / AI
11:30am - 11:55am
MT
Challenging the Status Quo: From Chip Innovation to Compute Optimization
Location: West Building,100 Level, Room 106 BC
Speaker (Foc):
Michael Munsey
– Siemens AG
Smart Data / AI
11:55am - 12:20pm
MT
Efficiency in the AI Era
Location: West Building,100 Level, Room 106 BC
Speaker (Foc):
SriLatha Manne
– Advanced Micro Devices, Inc
Smart Data / AI
12:20pm - 12:45pm
MT
Scaling AI - From Silicon to Systems
Location: West Building,100 Level, Room 106 BC
Speaker (Foc):
Rad Desiraju
– Microsoft
Smart Data / AI
2:00pm - 2:05pm
MT
Welcome Remarks and Session Overview
Location: West Building,100 Level, Room 106 BC
Session Moderator (FoC):
Pushkar Apte
– SEMI
Smart Data / AI
2:05pm - 2:30pm
MT
Next generation semiconductor to support AI resiliency
Location: West Building,100 Level, Room 106 BC
Speaker (Foc):
Noriko Suzuki
– IBM
Smart Data / AI
2:30pm - 2:55pm
MT
Merck KGaA, Darmstadt, Germany – The Glue Layer of Semiconductors: Powering Energy-Efficient Chips Through Advanced Materials
Location: West Building,100 Level, Room 106 BC
Speaker (Foc):
Laura Matz
– Merck KGaA, Darmstadt, Germany
Smart Data / AI
2:55pm - 3:20pm
MT
HPE Labs - Computing Futures from AI to Quantum to GenZ
Location: West Building,100 Level, Room 106 BC
Speaker (Foc):
Kirk M. Bresniker
– Hewlett Packard Enterprise
Smart Data / AI
3:20pm - 3:45pm
MT
Breaking the I/O Wall: Power-Efficient Interconnects for the AI Era
Location: West Building,100 Level, Room 106 BC
Speaker (Foc):
Jürgen Hatheier
– Ciena
Smart Data / AI
3:45pm - 4:10pm
MT
A modular and open approach to superconducting quantum computing
Location: West Building,100 Level, Room 106 BC
Speaker (Foc):
Subodh Kulkarni
– Rigetti
Smart Data / AI
4:10pm - 4:35pm
MT
QED-C: At the intersection of quantum + AI + semiconductors
Location: West Building,100 Level, Room 106 BC
Speaker (Foc):
Celia Merzbacher
– Quantum Economic Development Consortium
Smart Data / AI
4:35pm - 4:40pm
MT
Closing Remarks
Location: West Building,100 Level, Room 106 BC
Session Moderator (FoC):
Pushkar Apte
– SEMI
Smart Data / AI
11:00am - 12:00pm
MT
Film Frame FOUP (FFF) Task Force Meeting
Standards
11:00am - 12:00pm
MT
Next Gen Assembly / Test Material Handling (NGAT) Japan Task Force Meeting
Location: North Building, 200 Level, 229B
Standards
11:00am - 12:00pm
MT
S7 Revision Task Force Meeting
Standards
11:00am - 12:00pm
MT
S7 Revision Task Force Meeting
Location: North Building, 200 Level, 232B
Standards
11:00am - 12:00pm
MT
Sensor Bus Task Force Meeting
Standards
11:00am - 12:00pm
MT
Sensor Bus Task Force Meeting
Location: North Building, 200 Level, 231A
Standards
1:00pm - 2:00pm
MT
Lunch Session (Sponsored by Nvidia): Ecosystem-Connected Digital Twins: Transforming Semiconductor Fabs with Nvidia Omniverse
Panel Moderator (SMfg):
Vikram Natarajan
– Nvidia Omniverse
Panelist (SMfg):
Jin Lim
– SK hynix
Panelist (SMfg):
Scott D. Rothenberg
– Applied Global Services, Applied Materials
Panelist (SMfg):
Alexander Schafgans
– ASML
Panelist (SMfg):
Glenn Muzyka
– TSMC Arizona
Smart Manufacturing
1:00pm - 2:00pm
MT
Lunch Session (Sponsored by Nvidia): Ecosystem-Connected Digital Twins: Transforming Semiconductor Fabs with Nvidia Omniverse
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Panel Moderator (SMfg):
Vikram Natarajan
– Nvidia Omniverse
Panelist (SMfg):
Jin Lim
– SK hynix
Panelist (SMfg):
Scott D. Rothenberg
– Applied Global Services, Applied Materials
Panelist (SMfg):
Alexander Schafgans
– ASML
Panelist (SMfg):
Glenn Muzyka
– TSMC Arizona
Smart Manufacturing
Sponsor
1:00pm - 2:15pm
MT
Voluntary Carbon Markets & Carbon Pricing
EHS & Sustainability
1:00pm - 2:15pm
MT
Voluntary Carbon Markets & Carbon Pricing
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
EHS & Sustainability
1:00pm - 1:20pm
MT
Advance Market Commitments – Why Early Action in the VCM Matters and How Companies can Lead
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Speaker (Sus):
Justin Harris
– SEMI
EHS & Sustainability
1:20pm - 1:40pm
MT
Building Carbon Credits from High-Impact GHG Reduction
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Speaker (Sus):
Harris Cohn
– Charm Industrial
EHS & Sustainability
1:40pm - 2:00pm
MT
Linking Climate Commitments with Ecosystem Restoration
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
EHS & Sustainability
2:00pm - 2:15pm
MT
SEMI F-Gas Credit Program: Unlocking High-Impact GHG Reductions
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Speaker (Sus):
David Oliver
– Suomi Advisory Group
EHS & Sustainability
1:00pm - 3:00pm
MT
S1 (Labels) Revision Task Force Meeting
Standards
1:00pm - 3:00pm
MT
S1 (Labels) Revision Task Force Meeting - Part 1
Location: North Building, 200 Level, 232B
Standards
1:00pm - 4:00pm
MT
Diagnostic Data Acquisition (DDA) Task Force Meeting
Standards
1:00pm - 4:00pm
MT
Diagnostic Data Acquisition (DDA) Task Force Meeting
Location: North Building, 200 Level, 231A
Standards
1:00pm - 4:00pm
MT
Emerging Technologies and Innovation Partnerships
Startup
1:00pm - 4:00pm
MT
Emerging Technologies and Innovation Partnerships
Location: West Building, 100 Level, 102 AB
Startup
Presentation Partner
1:00pm - 1:03pm
MT
Welcome Remarks - Plug and Play Tech Center
Location: West Building, 100 Level, 102 AB
Session Moderator (Emerging Tech):
Dave Corsaro
– Plug and Play
Startup
1:03pm - 1:08pm
MT
Welcome Remarks - SEMI
Location: West Building, 100 Level, 102 AB
Speaker (Emerging Tech):
Joe Stockunas
– SEMI
Session Moderator (Emerging Tech):
Dave Corsaro
– Plug and Play
Startup
1:08pm - 1:10pm
MT
Welcome Remarks - Arizona Commerce Authority
Location: West Building, 100 Level, 102 AB
Speaker (Emerging Tech):
Sandra Watson
– Arizona Commerce Authority.
Startup
1:10pm - 1:20pm
MT
Welcome Remarks - City of Phoenix
Location: West Building, 100 Level, 102 AB
Distinguished Speaker:
Kate Gallego
– City of Phoenix, Arizona
Startup
1:20pm - 1:40pm
MT
Keynote: Arizona State University
Location: West Building, 100 Level, 102 AB
Speaker (Emerging Tech):
Michael Crow
– Arizona State University
Startup
1:40pm - 2:10pm
MT
Executive Fireside Chat: Shaping the Next-Generation of AI
Location: West Building, 100 Level, 102 AB
Fireside Chat Moderator:
Sandra Watson
– Arizona Commerce Authority.
Fireside Chat Speaker (Emerging Tech):
Om Nalamasu
– Applied Materials
Fireside Chat Speaker (Emerging Tech):
Saeed Amidi
– Plug and Play
Fireside Chat Speaker (Emerging Tech):
Dinesh Ramanathan
– onsemi
Startup
2:10pm - 2:25pm
MT
Intel Corporation Innovation Pitch
Location: West Building, 100 Level, 102 AB
Speaker (Emerging Tech):
Frank Sanders
– Intel
Startup
2:25pm - 2:45pm
MT
Pilot Partnership Panel 1
Location: West Building, 100 Level, 102 AB
Panel Moderator (Emerging Tech):
Dave Corsaro
– Plug and Play
Panelist (Emerging Tech):
Caroline Cioe
– Arkestro
Panelist (Emerging Tech):
Edmund Zagorin
– Arkestro
Panelist (Emerging Tech):
Katherine Dei Cas
– EMD Electronics
Startup
2:25pm - 3:45pm
MT
Startups & Corporate Showcases: Successful Corporate/Startup Pilots
Location: West Building, 100 Level, 102 AB
Startup
2:45pm - 3:05pm
MT
Pilot Partnership Panel 2
Location: West Building, 100 Level, 102 AB
Panel Moderator (Emerging Tech):
Shea Bryant
– Plug and Play
Panelist (Emerging Tech):
Takehiro Ishiguro
– Mitsubishi Electric
Panelist (Emerging Tech):
Maher Lahmar
– Facilis
Startup
3:05pm - 3:25pm
MT
Pilot Partnership Panel 3
Location: West Building, 100 Level, 102 AB
Panel Moderator (Emerging Tech):
Sterling Cohen
– Plug and Play
Panelist (Emerging Tech):
Rob Telson
– CELUS
Panelist (Emerging Tech):
Carlos Gazca-Gamez
– Siemens
Startup
3:25pm - 3:45pm
MT
Pilot Partnership Panel 4
Location: West Building, 100 Level, 102 AB
Panel Moderator (Emerging Tech):
Jennifer Ard, MBA
– Intel Capital
Panelist (Emerging Tech):
Frank Abboud
– Intel
Panelist (Emerging Tech):
Patrick Naulleau
– EUV Tech
Startup
3:50pm - 4:00pm
MT
Closing Remarks
Location: West Building, 100 Level, 102 AB
Session Moderator (Emerging Tech):
Dave Corsaro
– Plug and Play
Speaker (Emerging Tech):
Sandra Watson
– Arizona Commerce Authority.
Startup
1:00pm - 4:00pm
MT
Liquid Chemicals North America Technical Committee Chapter Meeting - Day 1
Standards
1:00pm - 4:00pm
MT
Liquid Chemicals North America Technical Committee Chapter Meeting - Day 1
Location: North Building, 200 Level, 231B
Standards
1:00pm - 4:00pm
MT
Welcome Remarks
1:00pm - 1:20pm
MT
Welcome Remarks
Location: West Building, 100 Level, 106A
Startup
1:00pm - 4:05pm
MT
The Convergence of Semiconductor Manufacturing and Design
Design
1:00pm - 4:05pm
MT
The Convergence of Semiconductor Manufacturing and Design
Location: West Building, 100 Level, Room 101 C
Design
1:00pm - 1:05pm
MT
Welcome Remarks
Location: West Building, 100 Level, Room 101 C
Session Moderator (Design):
Bob Smith
– SEMI
Design
1:05pm - 1:10pm
MT
Session Overview
Location: West Building, 100 Level, Room 101 C
Session Moderator (Design):
Ming Zhang
– PDF Solutions
Design
1:10pm - 1:30pm
MT
Revolutionizing Silicon to Systems Design: Unlocking the Future with 2.5D and 3D Multi-Die Innovations
Location: West Building, 100 Level, Room 101 C
Speaker (Design):
Sutirtha Kabir
– Synopsys
Design
1:30pm - 1:50pm
MT
Manufacturing to Development to Manufacturing for Circular Collaboration Leveraging AI and Other EDA Advances
Location: West Building, 100 Level, Room 101 C
Speaker (Design):
David Kelf
– Breker Verification Systems
Design
1:50pm - 2:10pm
MT
Bridging the Silicon Divide: Converging Chip Design and Manufacturing in the Era of High Integration
Location: West Building, 100 Level, Room 101 C
Speaker (Design):
Lu Dai
– Qualcomm Technologies
Design
2:10pm - 2:30pm
MT
Chip design & manufacturing convergence: 3D design brings multi-physics requirements while manufacturing yield improvements require digital twin modeling and ingesting design data
Location: West Building, 100 Level, Room 101 C
Speaker (Design):
Joe Kwan
– Siemens EDA
Design
2:30pm - 2:50pm
MT
Multiphysics & Multiscale Challenges and Solutions for 3D Heterogenous Integration
Location: West Building, 100 Level, Room 101 C
Speaker (Design):
Sudarshan Mallu
– Ansys, part of Synopsys
Design
2:50pm - 3:00pm
MT
Break
Location: West Building, 100 Level, Room 101 C
Design
3:00pm - 3:50pm
MT
Panel Discussion: The Convergence of Semiconductor Manufacturing and Design
Location: West Building, 100 Level, Room 101 C
Panel Moderator (Design):
Ming Zhang
– PDF Solutions
Panelist (Design):
David Kelf
– Breker Verification Systems
Panelist (Design):
Lu Dai
– Qualcomm Technologies
Panelist (Design):
Joe Kwan
– Siemens EDA
Panelist (Design):
Sutirtha Kabir
– Synopsys
Design
3:50pm - 4:00pm
MT
Audience Q & A
Location: West Building, 100 Level, Room 101 C
Panel Moderator:
Ming Zhang
– PDF Solutions
Design
4:00pm - 4:05pm
MT
Closing Remarks
Location: West Building, 100 Level, Room 101 C
Session Moderator:
Bob Smith
– SEMI
Design
1:00pm - 5:00pm
MT
IEEE - IRDS Packaging Integration – History & Roadmap for AI
Heterogeneous Integration
Advanced Packaging
1:00pm - 5:00pm
MT
IEEE - IRDS Packaging Integration – History & Roadmap for AI
Location: West Building, 100 Level, Room 105 BC
Heterogeneous Integration
Advanced Packaging
1:00pm - 1:05pm
MT
Welcome and Introduction
Location: West Building, 100 Level, Room 105 BC
Session Moderator (AP):
Mark da Silva, PhD
– SEMI
Heterogeneous Integration
Advanced Packaging
1:05pm - 1:20pm
MT
Session Overview
Location: West Building, 100 Level, Room 105 BC
Speaker (AP):
Dev Gupta
– APSTL
Heterogeneous Integration
Advanced Packaging
1:20pm - 2:10pm
MT
History of Advanced Packaging & Applications to AI
Location: West Building, 100 Level, Room 105 BC
Speaker (AP):
Dev Gupta
– APSTL
Heterogeneous Integration
Advanced Packaging
2:10pm - 2:40pm
MT
IEEE-IRDS: The Comprehensive Semiconductor Roadmap That Has Driven the Industry for Three Decades
Location: West Building, 100 Level, Room 105 BC
Heterogeneous Integration
Advanced Packaging
2:40pm - 3:00pm
MT
Break
Location: West Building, 100 Level, Room 105 BC
Heterogeneous Integration
Advanced Packaging
3:00pm - 3:25pm
MT
New PI Architectures for AI
Location: West Building, 100 Level, Room 105 BC
Speaker (AP):
Paul Franzon
– North Carolina State University
Heterogeneous Integration
Advanced Packaging
3:25pm - 3:50pm
MT
Advanced Packaging Technology Gaps for Future PI for AI & H
Location: West Building, 100 Level, Room 105 BC
Speaker (AP):
Dev Gupta
– APSTL
Heterogeneous Integration
Advanced Packaging
3:50pm - 4:15pm
MT
New Dense Interconnects for AI
Location: West Building, 100 Level, Room 105 BC
Speaker (AP):
Laura W. Mirkarimi
– Adeia
Heterogeneous Integration
Advanced Packaging
4:15pm - 4:40pm
MT
Advanced Lithography for Dense Package Interconnects on Large Panels
Location: West Building, 100 Level, Room 105 BC
Speaker (AP):
Koichiro Saito
– Ushio America, Inc.
Speaker (AP):
Yu Takada
– Ushio
Heterogeneous Integration
Advanced Packaging
4:40pm - 5:00pm
MT
Q&A and Wrap up
Location: West Building, 100 Level, Room 105 BC
Session Moderator (AP):
Dev Gupta
– APSTL
Heterogeneous Integration
Advanced Packaging
1:30pm - 2:20pm
MT
Strategic Silicon: Geopolitics Shaping the Future of Semiconductors
Panel Moderator (CEO Summit):
Mackenzie Hawkins
– Bloomberg News
Panelist (CEO Summit):
Vince Jesaitis
– Arm
Panelist (CEO Summit):
Frank Heemskerk
– ASML
Panelist (CEO Summit):
Olivier Blachier
– Entegris
Panelist (CEO Summit):
Sarah Kemp
– Intel
Panelist (CEO Summit):
Rich Ashooh
– Lam Research
Executive Panel
1:30pm - 2:20pm
MT
Strategic Silicon: Geopolitics Shaping the Future of Semiconductors
Location: West Building, 300 Level, Ballroom 301A
Panel Moderator (CEO Summit):
Mackenzie Hawkins
– Bloomberg News
Panelist (CEO Summit):
Vince Jesaitis
– Arm
Panelist (CEO Summit):
Frank Heemskerk
– ASML
Panelist (CEO Summit):
Olivier Blachier
– Entegris
Panelist (CEO Summit):
Sarah Kemp
– Intel
Panelist (CEO Summit):
Rich Ashooh
– Lam Research
Executive Panel
1:30pm - 5:00pm
MT
Workforce Development: Raising Industry Awareness and Building a Future Workforce
Workforce Development
1:30pm - 5:00pm
MT
Workforce Development: Raising Industry Awareness and Building a Future Workforce
Location: Workforce Development Pavilion Theater, North Hall, Lower Level, Expo Floor
Workforce Development
1:30pm - 1:55pm
MT
Building the Future Workforce: Sparking K-12 Excitement with Microelectronics Education
Location: Workforce Development Pavilion Theater, North Hall, Lower Level, Expo Floor
Speaker (WFD):
Adam Eklund
– Arizona State University
Speaker (WFD):
Quintin Boyce
– Arizona State University
Speaker (WFD):
Rachna Mathur
– Arizona State University Preparatory Academy
Speaker (WFD):
Snow L. Piel
– Arizona State University
Workforce Development
2:00pm - 2:25pm
MT
Chips for the Future: Building K-12 Pathways to Semiconductor Careers
Location: Workforce Development Pavilion Theater, North Hall, Lower Level, Expo Floor
Speaker (WFD):
Camille Platts-McPharlin
– Microelectronics Education and Research Center - Boise State University
Speaker (WFD):
Hailey Lynch
– Boise State University - Microelectronics Education and Research Center
Speaker (WFD):
Cathy Ammirati
– Micron
Workforce Development
2:30pm - 2:55pm
MT
Building a Scalable, Collaborative Semiconductor Workforce Ecosystem: Lessons from Texas
Location: Workforce Development Pavilion Theater, North Hall, Lower Level, Expo Floor
Speaker (WFD):
Alyssa Reinhart
– Texas Institute for Electronics
Speaker (WFD):
Theodore Moise
– North Texas Semiconductor Institute/University of Texas at Dallas
Speaker (WFD):
Clayton Huber
– Texas A&M Semiconductor Institute
Workforce Development
3:00pm - 3:30pm
MT
Advancing Workforce Development Through Materials Science Education: Empowering K–12 Educators
Location: Workforce Development Pavilion Theater, North Hall, Lower Level, Expo Floor
Speaker (WFD):
Kristie Maravalli
– ASM Materials Education Foundation
Workforce Development
3:30pm - 3:55pm
MT
Project Circuit Breaker: Breaking Barriers and Entering the Field of Semiconductors
Location: Workforce Development Pavilion Theater, North Hall, Lower Level, Expo Floor
Speaker (WFD):
Nathan C. Mascarenhas
– Nikon Precision Inc.
Workforce Development
4:00pm - 4:55pm
MT
Allies in Action: Building Belonging in the Chip Industry
Location: Workforce Development Pavilion Theater, North Hall, Lower Level, Expo Floor
Panel Moderator (WFD):
Michelle Williams-Vaden
– SEMI Foundation
Panelist (WFD):
Jeannie Jesson
– WGNSTAR
Panelist (WFD):
Tim Brosnihan
– Silex Microsystems
Panelist (WFD):
Rachel Potter
– EMD Electronics
Workforce Development
1:30pm - 5:35pm
MT
Global Standards Summit
Standards
Global Standards
1:30pm - 5:35pm
MT
Global Standards Summit
Location: North Building, 200 Level, Room 229A
Standards
Global Standards
1:30pm - 1:40pm
MT
Welcome and Reminders
Location: North Building, 200 Level, Room 229A
Session Moderator (GSS):
Paul Trio
– SEMI
Standards
Global Standards
1:40pm - 1:55pm
MT
Introduction and Level Setting
Location: North Building, 200 Level, Room 229A
Session Moderator (GSS):
Supika Mashiro
– Tokyo Electron
Standards
Global Standards
1:55pm - 2:05pm
MT
Session 1: Supply Chain Traceability Overview
Location: North Building, 200 Level, Room 229A
Session Moderator (GSS):
Eric Bruce
– Samsung Austin Semiconductor
Standards
Global Standards
2:05pm - 2:20pm
MT
Semiconductor Traceability - From Standard to Implementation
Location: North Building, 200 Level, Room 229A
Speaker (GSS):
Daniel O'Loughlin
– Qualcomm
Standards
Global Standards
2:20pm - 2:35pm
MT
Chain Reaction: Protecting IP Across Transparent and Secure Semiconductor Supply Lines
Location: North Building, 200 Level, Room 229A
Speaker (GSS):
Randy Hall
– The Provenance Chain Network
Standards
Global Standards
2:35pm - 2:50pm
MT
Standards Committee: Product Security and Counterfeiting
Location: North Building, 200 Level, Room 229A
Speaker (GSS):
Neal Edwards
– AMD
Standards
Global Standards
2:50pm - 3:05pm
MT
Preventing Supply Chain Disruptions
Location: North Building, 200 Level, Room 229A
Speaker (GSS):
Krish Dharma
– SEMI
Standards
Global Standards
3:05pm - 3:15pm
MT
Session 1: Supply Chain Traceability Q&A
Location: North Building, 200 Level, Room 229A
Session Moderator (GSS):
Eric Bruce
– Samsung Austin Semiconductor
Standards
Global Standards
3:25pm - 3:35pm
MT
Session 2: Environmental Sustainability Overview
Location: North Building, 200 Level, Room 229A
Session Moderator (GSS):
Joy Marsalla
– Lam Research
Standards
Global Standards
3:35pm - 3:50pm
MT
Substance of Concern Communication Standard
Location: North Building, 200 Level, Room 229A
Speaker (GSS):
Andrew Petraszak
– Tokyo Electron US
Speaker (GSS):
Patrick Gottsacker
– Intel Corp.
Standards
Global Standards
3:50pm - 4:05pm
MT
Energy Efficient Manufacturing
Location: North Building, 200 Level, Room 229A
Speaker (GSS):
Slava Libman
– FTD Solutions
Standards
Global Standards
4:05pm - 4:20pm
MT
Environmental Sustainability Considerations in Building Future Facilities
Location: North Building, 200 Level, Room 229A
Speaker (GSS):
Nate J. Monosoff
– Jacobs
Standards
Global Standards
4:20pm - 4:30pm
MT
Session 2: Environmental Sustainability Q&A
Location: North Building, 200 Level, Room 229A
Session Moderator (GSS):
Joy Marsalla
– Lam Research
Standards
Global Standards
4:30pm - 5:15pm
MT
Global Standards Panel Discussion
Location: North Building, 200 Level, Room 229A
Panelist (GSS):
Neal Edwards
– AMD
Panelist (GSS):
Slava Libman
– FTD Solutions
Panelist (GSS):
Patrick Gottsacker
– Intel Corp.
Panelist (GSS):
Randy Hall
– The Provenance Chain Network
Panelist (GSS):
Nate J. Monosoff
– Jacobs
Panelist (GSS):
Daniel O'Loughlin
– Qualcomm
Panelist (GSS):
Krish Dharma
– SEMI
Panelist (GSS):
Andrew Petraszak
– Tokyo Electron US
Panelist (GSS):
Alex Milshteen
– Intel
Panel Moderator (GSS):
Mohamed Saleem
– ITW
Standards
Global Standards
5:15pm - 5:30pm
MT
Wrap Up and Next Steps
Location: North Building, 200 Level, Room 229A
Session Moderator (GSS):
Supika Mashiro
– Tokyo Electron
Standards
Global Standards
5:30pm - 5:35pm
MT
Closing Remarks and Adjourn
Location: North Building, 200 Level, Room 229A
Session Moderator (GSS):
Paul Trio
– SEMI
Standards
Global Standards
1:35pm - 5:00pm
MT
Resources for Expanding Operations in the US (REO), Day 1 PM
Session Moderator (REO):
Mike Severson
– Hodess Cleanrooms
Supply Chain | REO
1:35pm - 5:00pm
MT
Resources for Expanding Operations in the US (REO), Day 1 PM
Location: West Building, 100 Level, 104 AB
Session Moderator (REO):
Mike Severson
– Hodess Cleanrooms
Supply Chain | REO
1:35pm - 1:40pm
MT
Opening Remarks
Location: West Building, 100 Level, 104 AB
Session Moderator (REO):
Mike Severson
– Hodess Cleanrooms
Supply Chain | REO
1:40pm - 2:00pm
MT
Project Delivery Accelerator – Kill the “Go-Slow-Machine”
Location: West Building, 100 Level, 104 AB
Speaker (REO):
Beau Dromiack
– WMA Architects
Supply Chain | REO
2:00pm - 2:20pm
MT
Aging Freighter Fleets and the U.S. Semiconductor Rollout: Is Air Cargo Capacity a Hidden Risk?
Location: West Building, 100 Level, 104 AB
Speaker (REO):
Daniel Randig
– Kuehne+Nagel
Supply Chain | REO
2:20pm - 2:40pm
MT
SSOE - Hoffman - FDI experienced Engineering and Construction resources for your Program Expansions in the USA
Location: West Building, 100 Level, 104 AB
Speaker (REO):
Clem Wood
– SSOE Group
Supply Chain | REO
2:40pm - 3:10pm
MT
APPLYING PRODUCT MANUFACTURING PRACTICES FOR MEGA PROJECTS
Location: West Building, 100 Level, 104 AB
Speaker (REO):
Roberto Charron
– McKinsey & Company
Speaker (REO):
Geene Alhady
– Clark Pacific
Speaker (REO):
Loehl O’Brien
– Clark Pacific
Supply Chain | REO
3:10pm - 3:40pm
MT
Exhibit Break
Location: West Building, 100 Level, 104 AB
Supply Chain | REO
3:40pm - 3:45pm
MT
Opening Remarks
Location: West Building, 100 Level, 104 AB
Session Moderator (REO):
Eric Rude
– SEMI
Supply Chain | REO
3:45pm - 4:00pm
MT
Your U.S. Launchpad: How Greater Phoenix Powers Global Semiconductor Growth
Location: West Building, 100 Level, 104 AB
Speaker (REO):
Thomas Maynard
– Greater Phoenix Economic Council
Supply Chain | REO
4:00pm - 4:20pm
MT
The administration is driving reshoring. How the semiconductor industry and its U.S. customers can benefit in a virtuous spiral.
Location: West Building, 100 Level, 104 AB
Speaker (REO):
Harry C. Moser
– Reshoring Initiative
Supply Chain | REO
4:20pm - 4:40pm
MT
Digital Twins at Scale: The Role of 3D Modeling in Fab Construction
Location: West Building, 100 Level, 104 AB
Speaker (REO):
Ken Smerz
– ZELUS
Supply Chain | REO
4:40pm - 5:00pm
MT
Clark Street Associates - The Inside Playbook For Semiconductor Companies on How to Secure Government Funding under the New Trump Regime
Location: West Building, 100 Level, 104 AB
Speaker (REO):
Rex Sherry
– Clark Street Associates
Supply Chain | REO
2:00pm - 3:00pm
MT
Coffee Break
2:00pm - 3:00pm
MT
Coffee Break
Sponsor
2:00pm - 4:05pm
MT
Smart MedTech: Driving Healthcare Innovation with Semiconductors
Smart MedTech
2:00pm - 4:05pm
MT
Smart MedTech: Driving Healthcare Innovation with Semiconductors
Location: North Building, 300 Level, Hall B
Smart MedTech
2:00pm - 2:05pm
MT
Welcome Remarks
Location: North Building, 300 Level, Hall B
Session Moderator (SMedT):
Gity Samadi
– SEMI
Smart MedTech
2:05pm - 2:15pm
MT
The Medical Device Manufacturing Multiplier Consortium - MDM2
Location: North Building, 300 Level, Hall B
Speaker (SMedT):
Chris Yoo
– MDM2
Smart MedTech
2:15pm - 2:40pm
MT
MedTech Innovation and Value Creation
Location: North Building, 300 Level, Expo Floor
Speaker (SMedT):
Mohammad Behnam
– McKinsey & Company
Smart MedTech
2:40pm - 2:55pm
MT
Transforming the Future of Healthcare
Location: North Building, 300 Level, Hall B
Speaker (SMedT):
Steven Johnston
– EMD Electronics
Smart MedTech
2:55pm - 3:10pm
MT
Technologies for Wirelessly Connected Medical & Healthcare Point-of-Care Devices
Location: North Building, 300 Level, Hall B
Speaker (SMedT):
Anirban Bandyopadhyay
– GlobalFoundries
Smart MedTech
3:10pm - 3:30pm
MT
The Next 100 Years of EEG-based Devices
Location: North Building, 300 Level, Hall B
Speaker (SMedT):
Jonathon J. Parker
– Mayo Clinic
Smart MedTech
3:30pm - 3:45pm
MT
Innovating Beyond Implantables: Opportunities for the Future of Wearable Technologies
Location: North Building, 300 Level, Expo Floor
Speaker (SMedT):
Mohsen Askarinya
– MEDTRONIC
Smart MedTech
3:45pm - 4:00pm
MT
Integrated AI Acceleration at Edge: Powering Intelligent Patient-Centric Care
Location: North Building, 300 Level, Hall B
Speaker (SMedT):
Abhishek Khowala
– Intel Corporation
Smart MedTech
4:00pm - 4:05pm
MT
Closing Remarks
Location: North Building, 300 Level, Expo Floor
Session Moderator (SMedT):
Gity Samadi
– SEMI
Smart MedTech
2:00pm - 4:35pm
MT
TechTALKS: Driving the Future of Semiconductors with Next-Level Silicon Design
TechTALKS
2:00pm - 4:35pm
MT
TechTALKS: Driving the Future of Semiconductors with Next-Level Silicon Design
Location: TechTALKS, North Building, 300 Level, Expo Hall B
TechTALKS
2:00pm - 2:05pm
MT
Welcome Remarks and Session Overview
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Session Moderator (AdvS):
Madhavan Esayanur
– MEMC/GlobalWafers
TechTALKS
2:05pm - 2:30pm
MT
Keynote: Silicon Design and Manufacturing at Microsoft in the Cloud/AI Era
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Speaker (AdvS):
Selim Bilgin
– Microsoft
TechTALKS
2:30pm - 2:50pm
MT
Hybrid Bonding: Key to Future Heterogeneous Integration in the AI Era
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Speaker (AdvS):
Yi Shi
– Intel
TechTALKS
2:50pm - 3:10pm
MT
Advances of Photonic Integrated Circuits based on SOI Platform
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Speaker (AdvS):
Frederic Seve
– CEA-Leti
TechTALKS
3:10pm - 3:30pm
MT
Scaling AI and cloud optical interconnects with 300mm Silicon Photonics and SiGe BiCMOS innovations
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Speaker (AdvS):
Amit Shaligram
– STMicroelectronics
TechTALKS
3:30pm - 3:50pm
MT
MEMS-based Laser Scanning Displays for Augmented Reality
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Speaker (AdvS):
Ken Diest
– Meta
TechTALKS
3:50pm - 4:10pm
MT
Powering the Future: Optimized Silicon Substrates for GaN Power & RF devices
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Speaker (AdvS):
Jim Reed
– Okmetic
TechTALKS
4:10pm - 4:30pm
MT
Evolution of Edge/Endpoint AI and Challenges for Next-Gen Processors
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Speaker (AdvS):
Mark Rootz
– Alif Semiconductor
TechTALKS
4:30pm - 4:35pm
MT
Closing Remarks
Location: TechTALKS, North Building, 300 Level, Expo Hall B
Session Moderator (AdvS):
Madhavan Esayanur
– MEMC/GlobalWafers
TechTALKS
2:00pm - 4:50pm
MT
Smart Manufacturing 2: Agentic AI in Manufacturing Operations #1
Smart Manufacturing
2:00pm - 4:50pm
MT
Smart Manufacturing 2: Agentic AI in Manufacturing Operations #1
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Smart Manufacturing
Sponsors
2:00pm - 2:05pm
MT
Welcome Remarks and Session Overview
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Session Moderator (SMfg):
Doug Suerich
– PEER Group
Smart Manufacturing
2:05pm - 2:25pm
MT
Improving electrical equipment maintenance decisions to optimize the uptime of manufacturing plants
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
Benjamin Sandoval
– ABB
Speaker (SMfG):
Daryl Curran
– ABB
Smart Manufacturing
2:25pm - 2:45pm
MT
Machine Learning Method for Yield Management and Prediction in Compound Semiconductor Manufacturing
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
Tzu-Hsuan Chen
– PDF Solutions
Smart Manufacturing
2:45pm - 3:05pm
MT
Comprehensive autonomous R2R using Agentic AI to address today’s rising CMP processing challenges
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
Christopher Gould
– Future Foundation North America Inc
Speaker (SMfG):
Abeer Singhal
– Future Foundation North America Inc
Smart Manufacturing
3:05pm - 3:25pm
MT
Leveraging AI in Jabil’s Manufacturing Journey
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
Upasana U. Pandya
– AWS
Speaker (SMfG):
Vivian Sun
– Jabil Inc.
Speaker (SMfG):
Sachin Shetti
– AWS
Smart Manufacturing
3:25pm - 3:45pm
MT
Orchestrating Intelligence: Predictive AI Maintenance for the Modern Semiconductor Facility
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
Subhadra Sampathkumaran
– Intel Corp.
Smart Manufacturing
3:45pm - 4:05pm
MT
Virtual Metrology Done Right
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
Mike Young-Han Kim
– Gauss Labs
Smart Manufacturing
4:05pm - 4:25pm
MT
Accelerating Semiconductor Process Development with AI: Deep Dive into Real-World Case Studies
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker (SMfG):
Joel Li
– Cosmos Innovation
Smart Manufacturing
4:25pm - 4:45pm
MT
The Evolution of AI Applications for Process Control
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Speaker:
Jonathan M. Holt
– PDF Solutions, Inc
Smart Manufacturing
4:45pm - 4:50pm
MT
Closing Remarks
Location: Smart Manufacturing Pavilion Theater, North Building, Lower Level, Expo Floor
Session Moderator (SMfg):
Doug Suerich
– PEER Group
Smart Manufacturing
2:30pm - 2:35pm
MT
AY Young, Spokesperson, Producer, Singer, Songwriter and Youth Ambassador to the UN
EHS & Sustainability
2:30pm - 2:35pm
MT
AY Young, Spokesperson, Producer, Singer, Songwriter and Youth Ambassador to the UN
Location: West Building, 300 Level, Ballroom 301 A
EHS & Sustainability
2:30pm - 4:00pm
MT
Electron Microscopy (EM) Workflow Task Force Meeting
Standards
2:30pm - 4:00pm
MT
Electron Microscopy (EM) Workflow Task Force Meeting
Location: North Building, 200 Level, 232A
Standards
2:35pm - 3:35pm
MT
Sustainability Panel: Path to Success—The Semiconductor Industry Leads the Way for a Resilient Future
Panel Moderator (Sus):
Mousumi Bhat
– SEMI
Panelist (Sus):
Elena Kocherovsky
– Applied Materials
Panelist (Sus):
Beth Elroy
– Micron
Panelist (Sus):
Joshua Kang
– Qualcomm
Panelist (Sus):
Sanchali Bhattacharjee
– Google
Executive Panel
EHS & Sustainability
2:35pm - 3:35pm
MT
Sustainability Panel: Path to Success—The Semiconductor Industry Leads the Way for a Resilient Future
Location: West Building, 300 Level, Ballroom 301A
Panel Moderator (Sus):
Mousumi Bhat
– SEMI
Panelist (Sus):
Elena Kocherovsky
– Applied Materials
Panelist (Sus):
Beth Elroy
– Micron
Panelist (Sus):
Joshua Kang
– Qualcomm
Panelist (Sus):
Sanchali Bhattacharjee
– Google
Executive Panel
EHS & Sustainability
3:00pm - 4:00pm
MT
Fire Protection Task Force Meeting
Standards
3:00pm - 4:00pm
MT
Fire Protection Task Force Meeting
Location: North Building, 200 Level, 232B
Standards
3:00pm - 5:00pm
MT
CANCELLED
U.S. National Strategic Plan for Advanced Manufacturing – Town Hall for Semiconductor Manufacturing Inputs
Speaker:
Robert Rudnitsky, PhD
– National Institute of Standards and Technology (NIST)
Advanced Manufacturing
3:00pm - 5:00pm
MT
CANCELLED
U.S. National Strategic Plan for Advanced Manufacturing – Town Hall for Semiconductor Manufacturing Inputs
Speaker:
Robert Rudnitsky, PhD
– National Institute of Standards and Technology (NIST)
Advanced Manufacturing
3:00pm - 5:00pm
MT
U.S. National Strategic Plan for Advanced Manufacturing – Town Hall for Semiconductor Manufacturing Inputs
Speaker:
Robert Rudnitsky, PhD
– National Institute of Standards and Technology (NIST)
3:00pm - 3:05pm
MT
Welcome Remarks
Location: West Building, 100 Level, Room 103 A
Speaker:
Benjamin E. Kallen
– SEMI
Advanced Manufacturing
3:05pm - 3:20pm
MT
Welcome and Overview of the U.S. National Strategic Plan for Advanced Manufacturing
Location: West Building, 100 Level, Room 103 A
Speaker:
Robert Rudnitsky, PhD
– National Institute of Standards and Technology (NIST)
Advanced Manufacturing
3:20pm - 4:45pm
MT
Request for Information (RFI) Interactive Discussion
Location: West Building, 100 Level, Room 103 A
Speaker:
Robert Rudnitsky, PhD
– National Institute of Standards and Technology (NIST)
Advanced Manufacturing
4:45pm - 5:00pm
MT
Closing Remarks
Location: West Building, 100 Level, Room 103 A
Speaker:
Robert Rudnitsky, PhD
– National Institute of Standards and Technology (NIST)
Advanced Manufacturing
4:00pm - 4:30pm
MT
Energetic Materials EHS Task Force Meeting
Standards
4:00pm - 4:30pm
MT
Energetic Materials EHS Task Force Meeting
Location: North Building, 200 Level, 232B
Standards
4:00pm - 5:00pm
MT
Climate and Social Impact
EHS & Sustainability
4:00pm - 5:00pm
MT
Climate and Social Impact
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
EHS & Sustainability
4:00pm - 4:05pm
MT
Welcome Remarks
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Speaker (Sus):
Clea M. Edwards
– STMicroelectronics
EHS & Sustainability
4:05pm - 4:10pm
MT
Keynote
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Speaker (Sus):
Junko Nakaya
– Advantest America
EHS & Sustainability
4:05pm - 4:10pm
MT
Keynote: Climate FRESK
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Speaker (Sus):
Wojciech Osowiecki
– Lam Research
EHS & Sustainability
4:10pm - 4:45pm
MT
CESI in Action: Panel
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Session Moderator (Sus):
Clea M. Edwards
– STMicroelectronics
Panelist (Sus):
Wojciech Osowiecki
– Lam Research
Panelist (Sus):
Keiko Kurokawa Henry
– Tokyo Electron America
Panelist (Sus):
Derrick Emsley
– Veritree
Panelist (Sus):
Gregory C. Woods
– ASML
EHS & Sustainability
4:45pm - 4:55pm
MT
Communities, Sustainability & 21st Century Workforce
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Speaker (Sus):
Stefan Roots
– Chester City, PA
EHS & Sustainability
4:55pm - 5:00pm
MT
Impact Partner Presentation
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
Speaker (Sus):
AY Young
– Battery Tour
EHS & Sustainability
4:00pm - 5:00pm
MT
Welcome to Phoenix Reception
4:00pm - 5:00pm
MT
Welcome to Phoenix Reception
Location: North Building, Levels 100 and 300, Expo Floors
Sponsors
4:00pm - 5:30pm
MT
Fab & Equipment Computer & Device Security (CDS) Task Force Meeting
Standards
4:00pm - 5:30pm
MT
Fab & Equipment Computer & Device Security (CDS) Task Force Meeting
Location: North Building, 200 Level, 231A
Standards
4:30pm - 5:00pm
MT
S3 (Heating Systems) Revision Task Force Meeting
Standards
4:30pm - 5:00pm
MT
S3 (Heating Systems) Revision Task Force Meeting
Location: North Building, 200 Level, 232B
Standards
5:00pm - 6:00pm
MT
IRDS Session Happy Hour
5:00pm - 6:00pm
MT
IRDS Session Happy Hour
Location: West Building, 100 Level, Room 105 BC
Heterogeneous Integration
Advanced Packaging
5:00pm - 6:30pm
MT
Sustainability Reception
5:00pm - 6:30pm
MT
Sustainability Reception
Location: Sustainability Pavilion Theater, West Building, Lower Level, Expo Floor
EHS & Sustainability
Sponsors
6:00pm - 7:30pm
MT
SEMI Standards Awards Ceremony & Networking Event
Standards
6:00pm - 7:30pm
MT
SEMI Standards Awards Ceremony & Networking Event
Location: North Building, 200 Level, 223 Pre-Function
Standards
8:00pm - 11:30pm
MT
SEMICON West'ern
8:00pm - 11:30pm
MT
SEMICON West'ern
Location: 3rd Street
Sponsors
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