Test Vision: Day 2 - Session 4: Silicon Photonics

Session Moderator (TV)(s)

• 

  Preston McWithey

  Product Engineer
  Siemens EDA, TX, United States

Test: Advancing Together with Innovation

The Test Vision Symposium at SEMICON WEST is where semiconductor test experts and visionaries unite to shape the future of testing. This year’s theme, "Test: Advancing Together with Innovation," emphasizes the collaborative and innovative spirit driving advancements in semiconductor testing.

Semiconductors are the lifeblood of groundbreaking technologies, from autonomous vehicles and renewable energy to AI-powered systems and next-generation consumer electronics. Testing is essential to ensure these innovations meet the highest standards of reliability, quality, and performance. It goes beyond defect detection, driving advancements in production efficiency, design optimization, and cost reduction—all critical for the broader adoption of semiconductors across diverse applications.

The rapid evolution of semiconductor technologies demands innovative testing approaches. As we embrace challenges such as heterogeneous integration, wide-bandgap materials, THz RF frequencies, and highly complex safety-critical systems, collaboration becomes paramount. By working together, the industry can address the increasing complexity of test and pave the way for innovation in both design and manufacturing processes.

Test Vision 2025 creates a platform for open dialogue, knowledge sharing, and a forward-looking perspective on testing. This year’s symposium celebrates the spirit of partnership and ingenuity, welcoming abstracts on all topics related to semiconductor test. Join us to explore how collaboration and innovation are advancing the future of testing.

Presentations:

• 12:45pm - 1:30pm MT

  Lessons from building an AI enabled equipment strategy
  

  Keynote Speaker (TV): Ian Mazsa – Cohu
• 1:30pm - 1:45pm MT

  Innovative Testing Strategies for Si Photonic Devices in Engineering and Production Applications
  

  Speaker (TV): Dan Rishavy – FormFactor
• 1:45pm - 2:00pm MT

  Transitioning from Copper to Optics: HVM-Scalable Test Solutions for CPO-based HPC Devices
  

  Speaker (TV): Ira H. Leventhal – Advantest America, Inc.
• 2:00pm - 2:15pm MT

  Manufacturing Test Challenges for Co-Packaged Optics
  

  Speaker (TV): Vineet Pancholi – Amkor Technology, Inc.
• 2:15pm - 2:30pm MT

  Scaling Photonics Test for the Next Decade: Lessons from Wafer to Co-Packaged Optics
  

  Speaker (TV): Matthew Griffin – Teradyne
• 2:30pm - 2:45pm MT

  Advancing Defect Detection for 3D and Heterogeneous Semiconductor Systems
  

  Speaker (TV): Akshay Dipakkumar Harlalka – Atomic Machines Inc.
• 3:00pm - 3:15pm MT

  Session 4 review + Raffle
  

  Session Moderator (TV): Basak Ulutas Ozturkler – SEMI
• 3:15pm - 4:00pm MT

  Panel session: Test Technology in a Collaborative Era: Advancing Standards for Chiplets, Heterogeneous Integration, and System-Level Validation
  

  Panel Moderator (TV): Gaurav Verma – Qualcomm

  Panelist (TV): Marc Hutner – Siemens EDA

  Panelist (TV): Rich Lathrop – Advantest

  Panelist (TV): Jeorge S. Hurtarte, PhD, MBA – Teradyne

  Panelist (TV): Aasutosh Dave – FormFactor
• 4:00pm - 4:05pm MT

  Closing Remarks
  

  Session Moderator (TV): Gaurav Verma – Qualcomm