AI in Every Layer: Future-Ready Strategy for Technology and Talent

Artificial intelligence relies critically on semiconductor innovation to continue unlocking new opportunities. That reliance is so pervasive that AI is increasingly setting the pace for semiconductor advancement. We must drive transformative shifts in the roadmaps of both logic and memory devices to keep up. To do so, the industry needs to advance swiftly along multiple vectors, with progress needed in materials, processes, architectures, and integration.

Yet, the promise of AI faces a pivotal challenge: a global talent shortage that can constrain progress at a time of unprecedented opportunity. Conventional workforce models cannot keep pace with the complexity and scale demanded by advanced manufacturing. For the global market, and for the United States to capture this opportunity, the industry must fundamentally reimagine how expertise is cultivated, shared, and scaled.

Incremental change is no longer sufficient. The semiconductor industry must embrace a new paradigm, advancing layer by layer in both technology and talent development. Virtual twins, realistic simulation, a robust global training and research network, and collaborative robotics are catalysts that can help address the challenges posed.

Those who lead in scaling both silicon and talent will define the next era of AI. By advancing technology and workforce development together, the industry can build the future from the atomic level up—driving impact through every layer of innovation.