Executive Director, ESDA Alliance SEMI Milpitas, CA, United States
In this session we will discuss topics that highlight the increasing collaboration between semiconductor manufacturers and chip design teams to bring advanced systems to market. New technologies, including heterogeneous integration and advanced packaging technologies along with expanding critical applications such as automotive and medical, are the key drivers behind the need for collaboration.
Challenges and opportunities to be discussed include design and manufacturing security, long term reliability, system performance issues and modeling and verification that encompass the entire system. This session will be of interest to anyone involved in the manufacturing and design of advanced systems based on chiplets and advanced packaging technologies including 2.5D and 3D ICs, MCMs and others.
