The development to manufacturing static handoff has disintegrated as semiconductor physics become ever more complex. Chiplets, 3D packages and other factors drive development methodology changes, and those changes influence manufacturing protocols in a continuing circle of complexity. New manufacturing techniques demand unusual and surprising development changes and can benefit significantly if these development innovations can be leveraged for the common good. This presentation discusses an example recently the subject of a CHIPs act proposal, where thermal dissipation improvements can be actively assessed during system verification. By constraining test vector generation using heat map information, and by then leveraging this data back into manufacturing, heat control systems can be updated accordingly. The use of AI within this loop will also be discussed, to drive continuous improvements in tis flow.
