Semiconductors have driven remarkable improvements in computing and data storage, paving the way for the era of artificial intelligence. These advances are the result of decades of cost-effective scaling and new device technologies, which have made energy-efficient performance possible. Continued progress in holistic lithography will support further scaling of semiconductor devices, ensuring ongoing innovation through this decade and beyond.
This presentation highlights recent developments in ASML’s lithography portfolio, including Extreme Ultraviolet (EUV) lithography with 0.33 numerical-aperture (NA) tools already in high-volume manufacturing, with over 200 units shipped. The next-generation 0.55 NA (High-NA) tools have now shipped and are being prepared for high-volume manufacturing in the coming years. Deep Ultraviolet (DUV) lithography, including leading-edge immersion tools, and innovations in metrology and computational lithography are also discussed, as these advances help maximize the capabilities of exposure tools.
Achieving the best lithographic performance in high-volume manufacturing requires a holistic approach—combining exposure systems, metrology and inspection tools, and computational lithography algorithms. This includes optimizing the process window during setup, accurately measuring process capability, and actively controlling the process to maintain patterning quality. These steps are increasingly critical as device tolerances become tighter with each new technology node.
