Superconducting (SC) electronics are emerging as a key technology for enabling energy-efficient, high-performance computing (HPC), artificial intelligence (AI) and quantum information systems. We introduce a versatile NbTiN based fabrication platform designed for dense, scalable SC circuits. The platform integrates fully SC interconnects, Josephson Junctions, capacitors, and engineered flux-trapping structures. This comprehensive device stack supports compact and high-density circuit designs, addressing critical limitations in the current state-of-the-art SC technologies. Originally developed to support energy-efficient digital logic and AI acceleration, the platform’s flexibility also makes it well-suited for a wide range of quantum applications, including scalable single-photon detectors and hybrid quantum-classical interface circuits. Manufactured using 193i lithography on 300 mm wafers with a thermal budget of 420 °C, our technology is already fully compatible with existing CMOS infrastructure and provides a clear path for future technology scaling. Our technology is continuously evolving, and we’re working with the broader semiconductor ecosystem to improve on our deposition and etch techniques, uniformity and yield in the next phase of our development. These developments will provide significant steps towards transitioning NbTiN based SC technologies from research to industrial-scale production.