Senior Director of Technical Standards (Qualcomm) and Chairman (Accellera) and Chairman (RISC-V International) and Director (Si2) Qualcomm Technologies San Diego, CA, United States
As the semiconductor industry accelerates toward unprecedented levels of integration, the traditional boundaries between chip design and manufacturing are rapidly dissolving. This keynote explores the critical convergence of these domains, driven by the rise of system-on-chip (SoC) architectures, chiplet-based designs, and 3D integration technologies.
With innovation comes complexity. The need for multi-sourcing—across standard components like RISC-V and multi-foundry ecosystems—demands new levels of collaboration, standardization, and trust. Yet, this evolution introduces formidable challenges: from technical intricacies in co-optimizing design and process technologies, to ensuring interoperability through standard interfaces, to addressing systemic assumptions and securing the global supply chain.
This session will outline a path forward, highlighting how industry-wide standards, advanced design and verification tools, and deep foundry partnerships are enabling a more agile, secure, and scalable semiconductor future. Attendees will gain insights into how leading-edge companies are navigating this convergence to unlock innovation while managing risk and complexity. As the semiconductor industry accelerates toward unprecedented levels of integration, the traditional boundaries between chip design and manufacturing are rapidly dissolving. This keynote explores the critical convergence of these domains, driven by the rise of system-on-chip (SoC) architectures, chiplet-based designs, and 3D integration technologies.
With innovation comes complexity. The need for multi-sourcing—across standard components like RISC-V and multi-foundry ecosystems—demands new levels of collaboration, standardization, and trust. Yet, this evolution introduces formidable challenges: from technical intricacies in co-optimizing design and process technologies, to ensuring interoperability through standard interfaces, to addressing systemic assumptions and securing the global supply chain.
This session will outline a path forward, highlighting how industry-wide standards, advanced design and verification tools, and deep foundry partnerships are enabling a more agile, secure, and scalable semiconductor future. Attendees will gain insights into how leading-edge companies are navigating this convergence to unlock innovation while managing risk and complexity.
