Chip design & manufacturing convergence: 3D design brings multi-physics requirements while manufacturing yield improvements require digital twin modeling and ingesting design data

Vertical construction, using chiplets and 3D assembly, is enabling Moore’s Law into the future. As this flow gains wide acceptance for bleeding edge semiconductor system design, it introduces significant novel challenges. Power, thermal, and stress effects impact performance and reliability. Multi-physics analysis is required to predict areas of impact in system design. While new physics considerations enter the design stage, novel manufacturing analysis methods require ingesting design data to inform yield improvements. ML fab solutions combine design and process information to create a digital twin for virtual analysis and yield improvement.