The Next-Generation Advanced Foundry: Accelerating 2nm & Advanced Packaging Innovation Through Global Collaboration

Less than three years ago, Rapidus, in close collaboration and backing by the Japan government, unveiled its ambitious plan to revitalize Japan’s semiconductor manufacturing industry and respond to the surging global demand for advanced chips essential for enabling autonomous driving, AI and smart cities, among other markets.

With a bold vision that integrates both cutting-edge 2nm logic technology and advanced packaging, Rapidus is redefining the traditional foundry model. Its state-of-the-art fab, called Integrated Integration for Manufacturing (IIM), incorporates AI-driven manufacturing and design, seamless front-end and back-end integration and a holistic approach to system-level innovation.

The presentation will highlight the company’s pivotal role in bringing 2nm logic chip manufacturing to the market and re-establishing Japan as a global leader in next-generation semiconductor technology. The presentation will emphasize Rapidus’ advancements in developing 2nm Gate-All-Around (GAA) transistors, its innovative approach to chiplet and advanced packaging solutions, the critical role of integrating front-end and back-end innovation and the strategic importance of international collaboration.