The U.S. semiconductor industry is undergoing a revitalization, and Purdue University has taken a leading role with its Semiconductor Degree Program (SDP) and the Scalable Asymmetric Life Cycle Engagement (SCALE) workforce development program. SDP offers a multidisciplinary curriculum spanning chip design, verification, manufacturing, and packaging, with contributions from ECE, ChE, IE, and MSE. The SCALE initiative is a multi-university effort aimed at development of semiconductor talent for defense and US industry. Enrollment in SDP related curricula has grown eightfold in under three years, driven by hands-on, industry-like experiences. This presentation highlights three key programs: SoCET, a multi-semester chip design initiative; VIP@Birck, focused on manufacturing and process control; and STARS, a full-time summer internship offering tracks in design, manufacturing, and packaging. These programs go beyond traditional coursework, immersing students in long-term projects that continue to evolve and contribute after the semester ends. Together, SDP, SCALE, STARS, SoCET, and VIP@Birck form a robust framework for preparing undergraduates to enter the semiconductor workforce early and effectively.
