As the semiconductor industry targets $1 trillion in market value, rapid fab capacity expansion is essential—but increasingly complex. Projects today face tighter budgets, aggressive timelines, and workforce and supply chain constraints.
This session will highlight ways to improve project certainty and performance through centralized project delivery, unified design/engineering, and the use of integrated technologies such BIM and 4D scheduling. These tools enhance transparency, and support project execution that improves schedule and budget certainty.
We will also explore strategies to overcome industry-wide challenges, including workforce development, offsite manufacturing, and programmatic supply chain management.
Participants will gain practical insights into managing the scale and complexity of today’s semiconductor fab projects through technology, planning, and execution discipline.