Sr. Solutions Architect Amazon Web Services Antioch, CA, United States
Abstract: In the rapidly evolving landscape of electronics manufacturing, the New Product Introduction (NPI) phase remains a critical juncture where design flaws and inefficiencies can significantly impact time-to-market and product quality. This presentation introduces an innovative approach to streamline the NPI process and enhance engineering efficiency through the deployment of AI-powered agents on edge platforms.
Our proposed framework leverages cutting-edge artificial intelligence models, including computer vision and time series analysis, tailored specifically to PCB and system design troubleshooting. These AI agents, trained on platform-specific data, operate on edge devices such as custom PCs or AI-enabled cameras, providing real-time insights and recommendations during the design and testing phases.
By integrating these AI agents into the NPI workflow, we aim to achieve several key objectives:
• Rapid identification and resolution of design issues: AI agents enable faster and more precise root cause analysis, significantly reducing defects and production downtime • Proactive optimization of system performance: AI-driven tools in design, testing, and production are revolutionizing PCB manufacturing by optimizing design, improving yields, and automating quality control • Minimization of human error in the troubleshooting process: AI-driven quality control systems are shown to increase defect detection rates, reduce inspection times, and enhance overall production throughput • Acceleration of the overall product development cycle: AI is closing the gap in PCB design by augmenting the abilities of engineers to accelerate design and bring products to market faster
The talk will explore the architecture of these AI agents, discussing the training methodologies employed to ensure their effectiveness across diverse design scenarios. We will also present case studies demonstrating the practical application of this technology in real-world NPI environments, highlighting tangible benefits such as a 30% reduction in defect rates and significant time savings in the development cycle.
Furthermore, we will address the challenges and considerations involved in implementing such a system, including data security, model interpretability, and integration with existing design tools and processes.
By the end of this presentation, attendees will gain insight into how AI-powered edge agents can revolutionize the PCB and system design process, ultimately leading to defect-free and optimized platform designs ready for the Mass Production phase. This approach not only enhances product quality but also significantly reduces time-to-market, providing a competitive edge in the fast-paced electronics industry.