This presentation addresses the critical role of defect identification in semiconductor components which are crucial to maintaining the integrity and performance of semiconductor manufacturing. It also explores the analytical techniques and diagnostic tools used to detect micro-contaminants and structural anomalies in components. Emphasis is placed on the integration of sealing technologies and their impact on contamination control, reliability, and yield optimization. Attendees will gain insights into current industry challenges and emerging solutions that enhance defect mitigation across semiconductor sub-systems and how SEMI SCIS has been carrying the torch the past decade to address component defects.