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    Test Vision

    Test Vision Poster Session and Reception

    Wednesday, October 8, 2025
    3:10pm - 5:00pm MT
    Location: North Building, 100 Level, Ballroom 120BC

      Session Moderator (TV)(s)

    • Stuart Pearce

      Sr Director, Head of ATE and Test instruments
      AEM
      Chandler, AZ, United States

    • Trent Weaver

      Product Manager
      Teradyne

    • Rick Marshall

      Vice President of Sales
      PDF
      San Jose, CA, United States

    Presentations:

    • 3:10pm - 5:00pm MT
      Accelerating Post-Silicon Validation with TestOps: A DevOps-Inspired, AI-Enabled Workflow

      Poster Presenter (TV): Vijay Krishna Guru – Soliton Technologies

    • 3:10pm - 5:00pm MT
      Addressing the Dynamic Landscape of Post-Silicon Validation with A Standardized Software Framework

      Poster Presenter (TV): Navin Subramani – Soliton Technologies Inc

      Poster Presenter (TV): Dhibana Kesavan – Soliton Technologies Pvt Ltd

    • 3:10pm - 5:00pm MT
      Advanced inspection systems for next-generation photonic materials

      Poster Presenter (TV): John Byrnes – Semilab USA LLC

    • 3:10pm - 5:00pm MT
      An FPGA-Based Neuromorphic-Deep Learning Fusion Architecture for Energy Efficient AI Applications

      Poster Presenter (TV): Jaelyn S. Liang – UCSD Health

    • 3:10pm - 5:00pm MT
      An Innovative Way to Achieve Lowest the Detection Limits in an All Hot Plasma via ICP-MS

      Poster Presenter (TV): Bert Woods – Agilent Technologies

    • 3:10pm - 5:00pm MT
      Artificial Intelligence Agents Boost Engineer Productivity

      Poster Presenter (TV): Andy Kittross – Teradyne

    • 3:10pm - 5:00pm MT
      Automated Testing of Large-Area Diamond Schottky Diode Arrays for Enhanced Manufacturability

      Poster Presenter (TV): Trevor Thornton – Arizona State University

      Poster Presenter (TV): Ankita Kashyap – Arizona State University

    • 3:10pm - 5:00pm MT
      Correlative Imaging Pipeline for High-Precision and Fast Test Metrology of TSV Arrays

      Poster Presenter (TV): Pouya Tavousi – University of Connecticut

    • 3:10pm - 5:00pm MT
      Data Integrity and Device Handling Challenges For Expanded Wafer and Device Testing

      Poster Presenter (TV): JERRY BROZ – Gel-Pak, a Delphon Industries Company

      Poster Presenter (TV): Victoria Tran – Gel-Pak, a Delphon Industries Company

    • 3:10pm - 5:00pm MT
      Domain Knowledge: The Key Ingredient to Effective and Sustainable Agentic Systems

      Poster Presenter (TV): Navin Subramani – Soliton Technologies Inc

    • 3:10pm - 5:00pm MT
      Enhancing Acoustic Image Analysis Through Machine Learning

      Poster Presenter (TV): Rebecca McCordic – Nordson

    • 3:10pm - 5:00pm MT
      Flying Probe Tester Solution for Advanced Package

      Speaker (TV): Takumi Kobayashi – HIOKI E.E. CORPORATION

      Speaker (TV): Ivan DeGuzman – HIOKI E.E. CORPORATION

    • 3:10pm - 5:00pm MT
      From Lab to Fab: Building the Collaborative R&D Engine for Materials Innovation

      Poster Presenter (TV): Vidyut Gopal – EMD Electronics

    • 3:10pm - 5:00pm MT
      GaN High Electron Mobility Transistors with Novel Dielectrics and Etching for Power Electronics

      Poster Presenter (TV): Junzhe Xie – Arizona State University

      Poster Presenter (TV): Ziyi He – Arizona State University

      Poster Presenter (TV): Houqiang Fu – Arizaon State University

    • 3:10pm - 5:00pm MT
      High Performance Compute: Advanced Packaging Impacts to Test Equipment

      Poster Presenter (TV): Vineet Pancholi – Amkor Technology, Inc.

      Poster Presenter (TV): YoungSoo Lee – Amkor Technology Inc.

    • 3:10pm - 5:00pm MT
      High Voltage DUT Power Supply IC for Automotive Grade Testing

      Poster Presenter (TV): Treasa S. Hlaing – ElevATE Semiconductor Inc.

    • 3:10pm - 5:00pm MT
      High-Speed Photoluminescence Inspection for Killer Defect Detection/Binning in Power Semi Substrates

      Poster Presenter (TV): YU-HSIEN LIN – Onto Innovation

    • 3:10pm - 5:00pm MT
      High-Temp Characterization of Monolayer MoSe₂ FETs for Extreme Environment Sensors & Electronics

      Poster Presenter (TV): Yashvi Singh – Stanford Univeristy

    • 3:10pm - 5:00pm MT
      High-Throughput Wafer Metrology: Roughness and Mechanical Mapping with Alphacen 300

      Poster Presenter (TV): Edward Nelson – Nanosurf / SPEC-TII

      Poster Presenter (TV): Dominik Ziegler – Nanosurf AG

    • 3:10pm - 5:00pm MT
      High-Volume Manufacturing Testing for Silicon Photonics and Co-Packaged Optics: Gaps and Solutions

      Poster Presenter (TV): Diwas Shrestha – Advantest Europe GmbH

      Poster Presenter (TV): Michael Kwok – Advantest America Inc.

    • 3:10pm - 5:00pm MT
      How Heterogeneous Integration Is Reshaping ATE Requirements

      Poster Presenter (TV): Mason Lyu – Chroma ATE Inc.

    • 3:10pm - 5:00pm MT
      Improving Productivity in Test Program Management with GitHub Version Control

      Poster Presenter (TV): Anastasiia Makhniaieva – ElevATE Semiconductor

    • 3:10pm - 5:00pm MT
      In-Process Test Challenges in Hybrid Packaging Assembly

      Poster Presenter (TV): Jeffrey hwang – ASE Group / CRD / Corporate Test R&D

    • 3:10pm - 5:00pm MT
      Josephson Junctions with high thermal stability for Superconducting Digital Logic

      Poster Presenter (TV): Sarthak Hajirnis – University of Arizona

    • 3:10pm - 5:00pm MT
      Lattice Damage of GaN and HEMT Investigated by T-Ray Imaging and Deep-level Time-Domain Spectroscopy

      Poster Presenter (TV): Anis Rahman – Applied Research & Photonics, Inc.

      Poster Presenter (TV): Rick L. Wise – Applied Research & Photonics, Inc.

    • 3:10pm - 5:00pm MT
      Metrology Sensor Technology Significantly Improving Yields & Processes for Front-End Tools

      Poster Presenter (TV): Vidya Vijay – Nordson

    • 3:10pm - 5:00pm MT
      Modernizing Post-Silicon Validation Using a GenAI-Based Agentic TestOps Ecosystem

      Poster Presenter (TV): Govarthanam Krishnasamy – Soliton Technologies Pvt. Ltd.

    • 3:10pm - 5:00pm MT
      Optimizing Device Interface Board Design with Machine Learning for Analog and Digital Test Platforms

      Poster Presenter (TV): Laura Rojas – Teradyne

    • 3:10pm - 5:00pm MT
      Revolutionizing AMS Chip Validation : AI Agent-Assisted Workflow for Validation Engineers

      Poster Presenter (TV): Pearl He – Gubo Technologies

    • 3:10pm - 5:00pm MT
      Semiconductor Carrier Concentration and Transition Layer Profiling by T-ray Pump-Probe Interference

      Poster Presenter (TV): Anis Rahman – Applied Research & Photonics, Inc.

      Poster Presenter (TV): Rick L. Wise – Applied Research & Photonics, Inc.

    • 3:10pm - 5:00pm MT
      Testing AI: A Flood of Post-Selection Misconduct (P-Hacking) and a Holistic Solution

      Poster Presenter (TV): JUYANG WENG – GENISAMA

      Poster Presenter (TV): Min Guo – GENISAMA

    • 3:10pm - 5:00pm MT
      The Age of Singulated Die Test

      Poster Presenter (TV): Brent Bullock – Advantest America Inc

    • 3:10pm - 5:00pm MT
      Total and Partial Vacuum Measurement: Verification for High-Purity Applications and Guard for Load Locks

      Poster Presenter (TV): Klaus Bergner – VACOM

    • 3:10pm - 5:00pm MT
      Toward an Autonomous Test Decision Center: A Vision for Context-Aware Engineering Intelligence

      Poster Presenter (TV): Deepshikha Shekhawat – Advanced Micro Devices

      Poster Presenter (TV): Neeraj C. Shukla – Deloitte USA

    • 3:10pm - 5:00pm MT
      Ultrafast Laser-Based Sample Preparation: Enhancing FIB/SEM Workflows for High-Throughput Analysis

      Poster Presenter (TV): Oytun Tasgit – 3D-Micromac AG

    • 3:10pm - 5:00pm MT
      Upskilling Test Engineers with AI

      Poster Presenter (TV): Constantinos Xanthopoulos – Advantest America, Inc.

    • 3:10pm - 5:00pm MT
      Vibe Coding in Practice: Accelerating Semiconductor Test Applications with LLMs

      Poster Presenter (TV): Benny Wang – Advantest