Heterogeneous Integration (HI) is redefining Automated Test Equipment (ATE) requirements by introducing architectural and operational complexities across the test lifecycle. HI technologies—such as 2.5D/3D integration with TSVs, fan-out wafer-level packaging, and chiplet-based systems using diverse I/O protocols (PCIe, LPDDR, SerDes, MIPI)—demand ATE platforms with multi-protocol, high-bandwidth, and fine-grained signal integrity capabilities. Wafer-level testing of Known Good Dies (KGDs) before packaging is essential to minimize downstream yield loss, driving the need for advanced probe interfaces and standardized testing protocols. After packaging, system-level testing (SLT) becomes critical to verify inter-chiplet communication, embedded firmware functionality, and proper power sequencing. This requires Automated Test Equipment (ATE) to support features such as boundary scan, scan chain testing, and coordination with built-in self-test (BIST) mechanisms. Thermal density and reduced test access further compel innovations in thermal management and Design-for-Test (DFT) architectures (e.g., IEEE 1500/1687, JTAG). A multi-stage, cost-optimized test flow—spanning wafer, partial stack, and final package levels—is essential. ATE must evolve into a collaborative, system-aware platform to ensure performance, reliability, and time-to-market in the HI era.
