The semiconductor industry faces mounting challenges as device scaling drives up costs, energy consumption, and carbon emissions. Advanced lithography nodes rely on increasingly complex EUV multi-patterning processes, demanding vast amounts of power, water, and critical materials—while also generating high greenhouse gas emissions. With over 70% of a smartphone’s lifetime emissions originating from production, sustainability has become a defining issue for the sector.
AlixLabs introduces APS™ (Atomic Layer Etch Pitch Splitting), a breakthrough technology that simplifies semiconductor manufacturing by replacing conventional multi-patterning with a single-step atomic-level etch. APS™ reduces process complexity, shortens cycle times, and cuts mask costs by up to 45%. Importantly, it lowers energy consumption by as much as 60%, reduces clean water demand, and enables up to 90% fewer greenhouse gas emissions per mask layer compared to traditional approaches.
Proven on 300 mm wafers with leading foundries and IDMs, and demonstrated on Intel’s Low GWP test vehicles, APS™ is paving the way for greener, faster, and more cost-effective chip production at advanced nodes. With our ALPHA tool in industry PoC trials and a BETA system scheduled for 2026, AlixLabs is accelerating the path from lab to fab—bringing sustainability and competitiveness back to the core of semiconductor innovation.
