Mixx Technologies is a deep-tech startup building next-generation optical interconnect solutions that address one of the most critical bottlenecks in AI infrastructure: the widening gap between compute performance and data movement. As AI models scale exponentially, traditional interconnects are limited in bandwidth, radix, latency, and energy efficiency. This is where Mixx steps in.
At Mixx we are leveraging silicon-integrated optics to deliver non-blocking, energy-efficient data movement. Our 'Advanced 3DS Platform' enables petabit level end-to-end connectivity for AI workloads resulting in sustainable, efficient, and cost-effective scaling across data centers. The 3DS platform comprises three parts: (1) The Engine, (2) The Package and (3) The System - designed to enable seamless deployment of our product, the optical IO chiplet, into the AI ecosystem.
Our solution, purpose-built for AI, surpasses co-packaged optics (CPO) in power efficiency, radix and bandwidth density. Designed for seamless deployment and full interoperability with existing standards, our optical engine can easily save over 1,500 GWh per year - that's equivalent to saving the power of over 50 hyperscale data centers and offsetting over 1 million metric tons of CO2.
Formed by a world-class leadership team with deep roots in semiconductors, photonics, and volume production, Mixx is uniquely positioned to lead the next wave of innovation in AI infrastructure.