As AI, high-performance computing (HPC), and power electronics evolve, heat dissipation has become a critical bottleneck limiting performance, reliability, and energy efficiency. Traditional cooling approaches, like heat sinks, thermal pastes, or liquid systems, are energy-intensive, bulky, and unable to address heat directly at the source. These limitations are especially acute in next-generation chips, where performance depends on compact, high-density architectures and extreme power output. PROUD pioneers a next-generation in-chip cooling solution based on synthetic diamond – nature’s most thermally conductive material. Our patented technology integrates an ultra-thin diamond layer directly onto semiconductor wafers (CMOS, GaN, SiC) without interlayers or changes to existing chip designs. This forms a direct, internal thermal highway that efficiently extracts heat from within the chip structure itself. Unlike external or liquid cooling systems, PROUD’s solid-state solution offers compactness, robustness, and seamless integration into semiconductor foundries. It drastically improves heat management at the material level, unlocking higher chip clock speeds, greater rack densities, and sustained performance without thermal throttling, while reducing cooling energy demand and emissions.