Arieca has developed an advanced thermal interface material (TIM) that enables sustainable cooling of high-performance semiconductor chips. Our patented Liquid Metal Embedded Elastomer (LMEE) technology, which blends liquid metal and polymer, delivers an unprecedented combination of thermal efficiency, performance, and mechanical reliability. Our LMEEs are available as cost-effective, dispensable emulsions that are compatible with existing high volume manufacturing tools and allow for extremely low pressure spreading and excellent wetting. As the most adaptable TIMs on the market, Arieca’s LMEEs are poised to revolutionize cooling for next generation AI, SiC, and other heat-generating semiconductor chips for automotive, consumer, data center, and other applications.
