Continued device scaling into the “angstrom” nodes requires new architectures and supporting unit processes reliant on an explosion of new materials. Integration of any new material represents a significant engineering challenge, while the simultaneous integration of multiple new materials increases that challenge exponentially. In this presentation, we focus on the importance of close collaboration between tool manufacturer, chemical supplier, and integrated device manufacturer rather than working independently in parallel to maximize the velocity of key learning. Key areas of focus include understanding the fundamental properties of the material itself, and how they can impact on-wafer performance. Beyond that, having a detailed understanding of manufacturing process of the material itself is critical to understanding not only process variables, but the sources of any impurities which make their way through to the final product as used on tool. We will touch on material fingerprinting and how any impurities, components, or other properties can be correlated to process outputs at both the module level as well as key integrated parameters. Only with this level of understanding can HVM material and process stability be insured.