In just one-year (2016–17), Dense Off-Chip Integration (DOCI) using proven Advanced Packaging (AP) technologies doubled AI hardware performance—without new transistor nodes or billions in R&D. Today, similar breakthroughs are within reach.
Meet the pioneers of AP—right here in Arizona—who’ve led the world in packaging innovation for over 30 years. From robotic factories at Motorola to industry-standard tools for HBM, AI, and HPC, Arizona has been the true Silicon Valley of AP.
These trailblazers developed the theory behind DOCI, giving memory suppliers the confidence to invest in HBM back in 2015. Their work continues to shape the IEEE IRDS roadmap for future AP, driving power- and cost-efficient AI, HPC, and edge computing. Join us to hear their vision for the next wave of materials and equipment innovation—and why Arizona remains the global center of AP excellence.
