Head of the Photonic Packaging Lab
CEA LETI, France
Stéphane Bernabé (Member, IEEE) received the M.Sc. degree in Physics and Photonics engineering from the University Louis Pasteur of Strasbourg, France, in 1997. The same year, he graduated from the Ecole Nationale Supérieure de Physique de Strasbourg (ENSPS).
He has been R&D engineer and project leader in the field of optoelectronic packaging in companies Wavetek Wandel Goltermann (now Viavi), Radiall and Intexys Photonics, in charge of fiber optic module developments. In 2007 he joined the CEA-LETI Institute in Grenoble, France, in the Optics and Photonics Department, and has been involved in several research dealing with optoelectronic device packaging (Photonic Integrated Circuits, LED modules, components reliability, multiphysics modelling), and application of Silicon Photonics to Data communications and optical Networks on Chips (oNoC) for computing. He has been involved in several Europe and national funded R&D projects, pioneering Silicon Photonics in Europe. He is now heading the Photonics Packaging Lab at CEA-LETI, Grenoble, France.
Mr. Bernabé has published 60 papers, 17 patents, and co-authored 3 book chapters. His current interests are in Photonic/Electronic co-integration leveraging advanced packaging technologies, and PIC optical coupling. He is actively participating in ECTC and ESTC conference committees, and is a member of IEEE EPS.
Photonics/Electronics Convergence Leveraging Advanced Packaging: New Paradigms for AI and HPC
Thursday, October 9, 2025
1:55pm - 2:15pm MT