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    senthil kumar balasubramanian

    Mr
    Heraeus Electronics
    singapore, Singapore

    Senthil Kumar holds a Master of Science in Precision Engineering from Nanyang Technological University (NTU), Singapore.
    With over 20 years of experience in semiconductor packaging, he is a seasoned professional in the field.
    Currently, Senthil is an R&D Application Manager at Heraeus Materials Singapore, where he has been focusing on new product development of interconnection solutions for over a decade.
    Previously, he was a Senior Engineer at Infineon Technologies, where he implemented copper wire technology in automotive packages.
    He also spent five years at ASM Pacific Technology, specializing in wire bonding process engineering

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