Director of Solutions Engineering
Cohu (Tignis)
BALLSTON LAKE, NY, United States
Boyd Finlay is Director of Solutions Engineering at Tignis (a Cohu solution). He is a past recipient of the prestigious Scottish Engineering 'Young Scottish Engineer of the Year' award and has held engineering, operations and technical leadership positions at National Semiconductor, SEMATECH, and Globalfoundries. Boyd holds a BSc(hons) Instrumentation with Applied Physics from Glasgow Caledonian University, an MBA from Robert Gordon University, and is a US patent holder with 5 patents all in the field of semiconductor process and equipment control.
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Tuesday, October 7, 2025
11:55am - 12:15pm MT