Visiting Ph.D. candidate
University Of Washington
seattle, WA, United States
Shih-Chih (Leo) Lin, PMP, PMI-ACP, PMI-PBA, is a Program Manager at Nanya Technology Corporation (NTC), Taiwan, and a Ph.D. candidate in the Interdisciplinary Artificial Intelligence Program at National Tsing Hua University (NTHU). Supported by the National Science and Technology Council (NSTC), he is currently serving as a Visiting Ph.D. Candidate at the University of Washington (UW), USA, advancing global collaboration in AI and smart manufacturing.
At Nanya Technology, Mr. Lin has led major projects integrating AI into semiconductor production, including the Smart Carrier Access Station (SCAS), AI-enabled FOUP and wafer inspection systems, and advanced AMHS solutions. These innovations significantly improved efficiency and quality, delivering measurable cost savings and driving digital transformation across fabs.
His industrial contributions have been recognized with the Formosa Plastics Group Applied Technology Conference Awards (2023–2025) for AI-driven wafer and FOUP inspection, the Top 10 Outstanding Project Manager Award (PMI Taiwan, 2017), and the 2025 PMI Taiwan Chapter Award of Excellence in Project Management.
Mr. Lin is also active in the international research community. He has presented work on computer vision, anomaly detection, and AI-driven manufacturing at leading conferences including CVPR, ICCV, IJCAI, ECCV, ICIP, and BMVC, as well as earning recognition in Taiwan with the CVGIP 2025 Oral Presentation and the CVGIP 2024 Excellent Paper Award.
Through his combined roles in industry, academia, and international research, Mr. Lin continues to bridge AI innovation with real-world semiconductor applications, driving progress in smart manufacturing.
AI-Driven Optical Inspection Equipment and System for Wafer Macro Defect Detection
Wednesday, October 8, 2025
5:15pm - 6:30pm MT