Vice President of Engineering
Qualcomm, CA, United States
In January of 2024 Octavio Martínez returned to Qualcomm after nearly 6 years at Intel and Microsoft. As Vice President of Engineering, Octavio is leading the RF, Mixed Signal and Hardware Engineering Organization at Qualcomm.
At Microsoft, Octavio Martínez was vice president of product integrity for mixed reality products from 2021 to 2024. He was responsible for system (HW/SW) device validation and characterization, prototype builds, new product introduction, as well as quality and reliability for augmented reality (AR) products. He drove process improvements in manufacturing yields and tact time.
Octavio Martínez was vice president of Intel's Manufacturing Product Engineering Organization from 2018 to 2021. He was responsible for new product introduction and quality, as well as product development benchmarking and testing. During his tenure, Octavio brought server quality to well below 500 dpm (defects per million). In the benchmarking space, Octavio produced insightful studies and established initiatives that are currently driving significant improvement in execution and cost.
During Octavio’s tenure at Qualcomm from 1996 to 2018, he served as vice president of engineering responsible for product engineering and testing of many key silicon product families. This included Qualcomm's single-chip solution, RF transceivers, power amplifiers, power management, audio codecs and fingerprint sensors. He received Qualcomm's Upendra Patel Engineering Excellence Award three years in a row for his leadership of Qualcomm's single-chip product family, which produced more than one billion units. The single-chip product family included an application processor, modem, RF transceiver, power management, and audio chips all in a single package. Additionally, he has given many presentations and keynote addresses on topics related to semiconductor testing and product development at high-profile venues such as ITC, SemiconWest, Vision2020 and several others.
Martinez holds a master's degree in business administration and a bachelor's degree in electrical engineering, both from San Diego State University.
Test challenges in the era of 6G, AI & Disaggregation
Thursday, October 9, 2025
9:00am - 10:00am MT