Vice President, Corporate R&D
ASE
Kaohsiung, Taiwan (Republic of China)
Dr. CP Hung, IEEE Fellow, is currently Vice President of Corporate R&D, at ASE Group, responsible for next-generation product development featuring integrated technologies, as well as a broad range of advanced chip, package, test, and system integrating solutions for multiple ASE Sites.
He holds 354 patents encompassing IC packaging structure, process, substrate and characterization technology. He has published over 142 conference and journal papers.
Dr. Hung has being the SEMICON Taiwan PKG & TEST Committee Chair since 2013, and currently Co-Chair since 2021.
Innovative Advanced Packaging Solutions for AI
Wednesday, October 8, 2025
2:30pm - 2:55pm MT
Panel Discussion and Audience Q&A
Wednesday, October 8, 2025
4:10pm - 5:10pm MT