Semiconductor Research Engineer
Intel
Chandler, AZ, United States
Yi Shi joined Intel in 2020, shortly after earning his PhD in Mechanical Engineering from Northwestern University. He currently serves as a semiconductor research engineer with the Foundry Technology Research group at Intel. His primary focus is on the research and development of heterogeneous integration with hybrid bonding and the associated process and equipment. His areas of expertise include advanced packaging, mechatronic systems, laser and wafer jet technology, and micro-manufacturing. He has authored or co-authored over 25 technical papers in peer-reviewed journals and international conferences and has been awarded one patent, with an additional 30+ patents pending.
Hybrid Bonding: Key to Future Heterogeneous Integration in the AI Era
Tuesday, October 7, 2025
2:30pm - 2:50pm MT