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    PR Chidambaram

    Senior Vice President
    Qualcomm
    San Diego, CA, United States

    PR. Chidi Chidambaram runs the Process & Package Solutions team as a Senior Vice President of Engineering and is recognized as a Qualcomm Fellow. Qualcomm is a leader in the fabless industry – introducing leading-edge semiconductor technologies to manufacturing on both silicon and package options. As the low power and high-volume leader, Qualcomm has introduced many innovative DTCO solutions in the last 10 years and Chidi’s team is currently working on System level integration solutions. Chidi’s team is also responsible for Auto, RF and passive devices.
    Before joining Qualcomm, Chidi developed silicon technology at Texas Instruments and was instrumental in the first embedded SiGe implementation by the Semiconductor Industry. He is also recognized by the IEEE as a fellow for his contribution to strain engineering and design technology co-optimization (DTCO). In his 20+ year semiconductor career, evenly distributed between research and development, Chidi has written and earned over 150 referred articles and patents.

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