IEEE USA President
Boeing & IEEE, CA, United States
Timothy Lee, a Boeing Technical Fellow based in Southern CA, leads the development of microelectronics technologies for advanced communications networks and sensor systems for aerospace applications. His current research interests include heterogenous integration (Advanced Packaging), silicon Application Specific Integrated Circuits (ASICs) and III-V Monolithic Microwave Integrated Circuits (MMICs). He led the development of hardware for satellite communications customers. He is an active volunteer in the IEEE. He is the 2025 IEEE-USA President; seeking collaboration on technology policy for R&D, STEM education and Workforce Development. Previous roles includes IEEE Board of Directors (2021-2022 Region 6) and past President of the IEEE Microwave Theory and Technology Society (MTT-S). He leads several Technical Working Groups in the IEEE Heterogenous Integration Roadmap (HIR) and was the Vice-Chair in the IEEE Future Networks Technical Community.
The Impact of Policy on Advanced Semiconductors Ecosystem for Aerospace & Defense
Wednesday, October 8, 2025
2:55pm - 3:20pm MT
Panel Discussion and Audience Q&A
Wednesday, October 8, 2025
4:10pm - 5:10pm MT