Staff Engineer, Platform Infrastructure Engineering
Google
Sunnyvale, CA, United States
After earning his Ph.D. in Materials Science & Engineering from Georgia Tech in 2011, Chunqing launched a 14-year career at Intel, contributing to both the Assembly & Test Technology Development (ATTD) and Intel Foundry Service (IFS) groups. His work centered on advancing internal product development and enabling external customers by optimizing packaging architecture and assembly processes. He gained deep expertise across a range of leading-edge technologies, including 3D/2.5D heterogeneous packaging (Foveros, EMIB), Co-Packaged Optics, FCxGA, and FCCSP packaging. This experience spanned a diverse product portfolio, from Xeon server CPUs and high-performance GPUs to smartphone SOCs and modems. In March 2025, Chunqing joined Google Cloud Platform Infrastructure Engineering team, where he now focuses on developing innovative thermal cooling systems for AI/ML cloud servers.
Panel Discussion and Audience Q&A
Wednesday, October 8, 2025
11:25am - 12:25pm MT