Founder & President TechSearch International, Inc. Austin, Texas, United States
Assembly of Advanced Packages have been concentrated in regions of Asia for dozens of years. Geopolitical developments have pushed assembly of advanced packages to new regions. This presentation examines the trends in advanced packaging and the location of assembly capacity. Challenges to shifting capacity to new regions are addressed. Ecosystem requirements are discussed, including advanced substrates, interposers, materials, and flip chip assembly by OSATs and IDMs.
