AI innovation has been significantly boosting the demand for advanced packaging, particularly 3DIC solutions. 3DIC offers benefits such as cost efficiency, design flexibility, and enhanced system performance. However, as AI product introduction accelerates toward annual cadence, it presents unprecedented challenges to development cycle time and manufacturing ramping. Steep production ramp of every new generation of 3DIC process with excellent yield from the onset is a pre-requisite to fulfill 3DIC's value propositions. Eco-system partnerships among chiplet integrators, tool/material suppliers, and HBM/substrate industries are essential to continue advancing 3DIC packaging technologies forward.
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