CEO, President and Co-Founder PDF Solutions Santa Clara, CA, United States
Demand for advanced computing is robust, driven by AI, cloud technologies, and widespread electrification of the economy. As Moore's Law slows, the industry is pivoting toward innovative approaches—exploring 3D architectures, chiplets, and sophisticated hybrid packages. Concurrently, the semiconductor landscape is becoming increasingly global, with advanced devices now relying on integrating multiple chiplets into single packages. This shift demands unprecedented levels of collaboration and integration across the key semiconductor ecosystem players. A new type of industry platform is essential to unify these diverse stakeholders. This platform is specifically engineered to manage the unique characteristics and massive volumes of design and manufacturing data, while enabling secure collaboration with robust IP protection. With AI embedded throughout its architecture, the platform allows for each participant to rapidly evaluate and optimize its business decisions.