Executive Director Synopsys Sunnyvale, AZ, United States
Sutirtha Kabir will explore how Synopsys facilitates the transition to 2.5D and 3D multi-die designs from early architecture to manufacturing through a comprehensive and scalable solution, particularly in the context of exploration to signoff. Innovations in multi-die design, a key enabler in the pervasive intelligence era, create new requirements for closer collaboration between companies and design teams, and holistic approach to engineering. Having a unified platform for planning, implementation, and signoff of complex heterogeneous integration allows companies to boost productivity and optimize their multi-die design. Such capabilities speed up the re-engineering of how engineers leverage AI-enabled floorplanning, integrated thermal, stress, power analysis, and robust die-to-die connectivity verification to address critical challenges in design security, reliability, and performance. Learn how advanced packaging and system integration in next-generation multi-die designs is critical for success.
