As AI continues to demand higher performance computing, the need for more chips, faster chips, and more efficient chips is greater than ever. Advanced logic chip makers are now relying on hybrid bonding to combine chiplets, such as processors, memories, and sensors, to build more powerful and efficient chips, like AI accelerators. Conventional bonding technologies limit interconnect density, but hybrid bonding, a molecular-level copper and dielectric interconnection, allows for higher interconnect density and the ability to stack more memory. In light of this, hybrid bonding must evolve to unlock more powerful chiplets and create taller, denser 3D chip designs.
