Initially introduced to enable the deployment of the first generations of the Internet, fiber-optic interconnections are now deployed at various scales: Fiber-to-the-Home, inter Data Center and Intra Data Center interconnects. The optical netxworks are driving today's AI boom, as well as tomorrow's novel computing systems: High Performance Computing, neuromorphic computing and quantum computing. This revolution has only been made possible through the introduction of new technologies, enabling volume manufacturing of high speed photonic transceivers. Silicon photonics has enabled the large-scale integration of optical functions and has rapidely gained industrial maturity. In addition, advanced packaging techniques (3D), which have been massively developed in memory applications, mobile telephony and high-end CPUs, dramatically contributed to the convergence of photonics and CMOS devices, giving rise today to new paradigms, such as Co-packaged Optics (CPO) and photonic interposer based Optical Network on Chip (ONoCs). This presentation will review 15 years of developments in silicon photonics, with a focus on recent achievements using advanced packaging techniques such as TSV, chip stacking and FOWLP.
