Merck KGaA, Darmstadt, Germany – The Glue Layer of Semiconductors: Powering Energy-Efficient Chips Through Advanced Materials

In the era of artificial intelligence (AI), the semiconductor industry faces a defining challenge: delivering massive computational power without overwhelming energy demands.
The ability to achieve energy efficiency at scale is no longer optional — it is the critical requirement that determines whether technology can meet the world’s growing digital needs.
At the heart of solving this challenge are advanced materials, the essential “glue layer” that enables both performance and sustainability.
This keynote will explore how innovations in materials science are unlocking new pathways to energy-efficient computing — while ensuring the reliability, yield, and scalability that make these advances viable.
By pushing the boundaries of what materials can do, we are paving the way for chips that not only power the AI-driven future, but do so sustainably