The accelerating demands of artificial intelligence are reshaping the landscape of electronic systems—from energy-hungry data centers to ultra-efficient edge devices. This talk explores the foundational role of power delivery, conversion, and thermal management in enabling next-generation electronics that meet AI’s performance, density, and reliability needs. Drawing on recent research from our group at Stanford, Professor Srabanti Chowdhury will highlight advances in wide bandgap materials, 3D integration, and co-optimization strategies that underpin scalable, energy-aware design.
