Advancing AI and Digital Twin Security for Resilient Semiconductor Manufacturing

The semiconductor industry serves as the backbone of modern technology, enabling advancements across various domains. However, the digitization and globalization of semiconductor supply chains have introduced complex cybersecurity vulnerabilities. This presentation delves into the critical topic of AI and Digital Twin Security in Semiconductor Manufacturing, addressing the challenges posed by emerging technologies such as 5G and quantum computing.

With the rise of Artificial Intelligence (AI) and Digital Twin technologies, manufacturing processes have become more interconnected and efficient, but also increasingly exposed to cyber threats. These technologies enable real-time monitoring, simulation, and optimization of processes, significantly enhancing operational capabilities. However, they also create new attack surfaces that adversaries can exploit, underscoring the need for robust security frameworks.

The presentation explores strategies for safeguarding semiconductor manufacturing systems through collaboration between industry stakeholders, academia, and government. It emphasizes the importance of fostering alliances to build resilient cybersecurity solutions tailored to emerging technologies. Additionally, the discussion will consider how Digital Twin models can be leveraged not only for operational insights but also for predictive security measures, transforming vulnerabilities into opportunities for proactive defense.

By uniting experts across disciplines and institutions, the Texas A&M Semiconductor Institute aims to pioneer innovative approaches that secure the future of semiconductor manufacturing against evolving cyber threats. This session contributes to the conference’s overarching theme, "Secure Together: Building Cybersecurity Resilience Through Industry Alliances," spotlighting collaborative efforts to address supply chain security in the era of emerging technologies.