Silicon photonics has matured enough to enter mainstream deployment. Packaging technologies have evolved and matured to allow electrical and photonics ICs to be co-packaged. Data center application in recent press have made it ample evident that the time to perfect the manufacturing test work flow at the OSAT is now.
With my presentation, the audience will be able to walk away with an understanding of the manufacturing test challenges for co-packaged optics. The presentation will describe the electrical and optical test problem statement of testing ICs that switch or process data with high bandwidth (Multiple Tbps). It will include the critical production electrical and optical test list items. It will compare and contrast the changes relative to the traditional test work flow that the industry has perfected over the past 3 - 4 decades. It will also include the challenges that must be overcome collectively in the industry to perform initial deployment and efficiency improvements in the interest of test economics. Further, the presentation aims to describe the new test equipment requirements for production testing of the electrical and photonics IC that will allow the effective data rates that exceed multiple Tbps.
