High-Throughput Wafer Metrology: Roughness and Mechanical Mapping with Alphacen 300

As semiconductor devices scale down and materials become more complex, advanced metrology is critical for process development, defect detection, and reliability assurance. This presentation introduces the Alphacen 300 platform, a high-throughput, high-resolution atomic force microscopy (AFM) system optimized for cleanroom labs and semiconductor fabs. We will showcase its capabilities for wafer-scale mapping of topography and mechanical properties, including rapid surface roughness analysis with full power spectral density (PSD) characterization. Real-world use cases will illustrate how Alphacen supports process monitoring, CMP optimization, and material qualification, enabling precise, nanoscale insights that are essential for advanced node manufacturing.