Ultrafast Laser-Based Sample Preparation: Enhancing FIB/SEM Workflows for High-Throughput Analysis

As semiconductor devices become increasingly complex, efficient and precise sample preparation is critical for failure analysis, quality control, and advanced R&D. The microPREP® PRO FEMTO system introduces ultrafast, femtosecond laser technology into the FIB/SEM workflow, enabling high-speed, athermal material ablation with micrometer-level accuracy—significantly reducing prep time from hours to minutes.
By leveraging ultrashort pulse lasers, the system achieves large-volume material removal with minimal thermal impact, which is ideal for applications such as FIB trenching, APT microtip fabrication, and cross-sectioning of advanced packages. When integrated with Xe Plasma FIB-SEM systems, the hybrid workflow optimizes throughput: laser ablation performs the bulk excavation, followed by high-precision FIB polishing for final refinement.
This laser-based approach is particularly impactful in semiconductor manufacturing, where speed, repeatability, and accuracy are paramount. CAD-based targeting further enhances precision, enabling rapid access to specific regions of interest. Real-world case studies—ranging from flip-chip package analysis to atom probe tomography—demonstrate significant gains in productivity and process control.
This work will showcase how integrating femtosecond laser systems into semiconductor workflows is reshaping sample preparation, offering a scalable path to meet the demands of next-generation device analysis.