Future-proofing fabs: the power of predictive metrology in semiconductor manufacturing
While metrology isn’t a new field, historically, the need to open tools for manual measurement or inspection creates significant bottlenecks in production, often requiring stoppages, disruption of vacuum environments, and extended pump-down times before production can resume. For the industry to evolve and meet rising demands, the sensors and measurement technologies that support these processes must evolve as well. Thankfully, these challenges, and the increasingly demanding landscape of modern semiconductor manufacturing, are now being met head-on with cutting-edge innovations, welcoming the rise of advanced sensors that are not only shaping the long-term future of semiconductor manufacturing but also delivering critical efficiencies in the near term. These innovations, designed to unlock the power of predictive metrology, are enabling real-time, non-contact measurements that streamline operations, reduce downtime, and support the seamless automation that is essential for keeping pace with modern production needs. Aspects of the production line from chemical vapor deposition (CVD) to etching processes can now be integrated with advanced sensors to ensure the meticulous adherence to strict controls and ensure a more connected, streamlined production environment – ultimately boosting throughput.
Quality control unplugged
The ability of these sensors to deliver wireless and instantaneous measurements makes them an even more valuable pillar of the modern factory floor, particularly as manufacturers look to the future of lights-out production. With wireless, vacuum-compatible measurement, real-time feedback and predictive maintenance capabilities, next-generation sensors from Nordson are ideally positioned to keep pace with a rapidly evolving industry landscape and address the manufacturing challenges of tomorrow.
A new, innovative metrology sensor is designed to speed achieving accurate wafer placement calibration, proper alignment and set-ups. Essentially, it sees” inside semiconductor equipment to capture three dimensional offset data (x, y and z) to quickly center wafers with respect to the focus ring. The metrology sensor specifically designed for centering, will be the focus of this presentation and poster-session.
