TechTALKS

TechTALKS: Driving the Future of Semiconductors with Next-Level Silicon Design

Hybrid Bonding: Key to Future Heterogeneous Integration in the AI Era

Tuesday, October 7, 2025

2:30pm - 2:50pm MT

Location: TechTALKS, North Building, 300 Level, Expo Hall B

Speaker (AdvS)(s)

YS

Yi Shi

Semiconductor Research Engineer
Intel
Chandler, AZ, United States

Session Slides

The presentation includes background of hybrid bonding technology, advanced packaging with hybrid bonding, future packaging with hybrid bonding and challenges.