The carbon footprint of semiconductors has emerged as a critical concern for the sustainability of the Information and Communication Technology (ICT) industry and other industrial sectors. As the demand for semiconductors continues to rise, primarily driven by advancements in technology and increased digitalization, understanding and managing their environmental impact becomes paramount. This presentation aims to highlight the significance of accurate, transparent, and actionable data as foundational elements in the effective management of product-related carbon emissions. Currently, the industry faces significant challenges concerning the comparability of product carbon footprint (PCF) data. This lack of standardization hinders organizations from effectively measuring, reporting, and ultimately reducing their carbon emissions throughout the value chain. The presentation will provide a short overview of the current landscape of PCF calculations and reporting practices within the semiconductor sector, identifying key discrepancies and gaps in methodologies that contribute to the inconsistency of data. Moreover, the discussion will delve into the critical need for harmonization of PCF metrics across the industry, and on-going activities by the SEMI Semiconductor Climate Consortium (SCC) to overcome the current limitations. By establishing common frameworks and guidelines, stakeholders can ensure that carbon footprint data is not only comparable but also reliable and actionable. This will facilitate the implementation of effective strategies to meet greenhouse gas emission reduction targets. The presentation will conclude by outlining the essential next steps needed for alignment within the industry. By fostering a collective approach, the ICT industry can significantly enhance its sustainability efforts. Participants will leave with a clearer understanding of the current state of product carbon footprinting in the semiconductor industry and the collaborative actions required to create a more sustainable ICT ecosystem.