The semiconductor industry's reliance on potent fluorinated greenhouse gases (F-GHGs) and nitrous oxide (N2O). O) for critical manufacturing processes, such as plasma etching and chamber cleaning, presents a significant environmental challenge. In response, the February 2025 SEMI Semiconductor Climate Consortium (SCC) whitepaper, Overview of F-GHG and Nitrous Oxide Semiconductor Abatement Technologies, delivers a comprehensive analysis of current mitigation solutions to guide the industry in achieving its climate goals.
The whitepaper concludes that the optimal abatement strategy is complex but achievable . The selection depends on a holistic assessment of application-specific factors, including gas composition, flow rates, and facility-wide sustainability targets. Key evaluation metrics include DRE, cost of ownership, energy consumption, and process compatibility. This document serves as a crucial resource for engineers and environmental managers, highlighting the industry's clear trajectory toward adopting more energy-efficient technologies to ensure responsible manufacturing and environmental stewardship.
